Environment-friendly glue for silk-screen printing and lamination method of ceramic raw ceramic chip

Abstract

Belonging to the technical field of semiconductor manufacturing, the invention relates to an environment-friendly glue for silk-screen printing and a lamination method of a ceramic raw ceramic chip. The environment-friendly glue for silk-screen printing is composed of the following components by weight: 60-100 parts of a solvent, 0.6-1 part of an adipic acid ether plasticizer, 0.1-1 part of hydrogenated castor oil, 0.2-1 part of lecithin and 2-6 parts of ethyl cellulose. The glue is mainly applied to a laminating link of a ceramic packaging base, the glue is uniformly coated on a raw ceramic chip in a silk-screen printing mode, and after normal-pressure fixation and lamination, firm bonding between a ceramic casting raw ceramic chip and a raw ceramic chip is realized. After silk-screen printing and normal-pressure plate pressing (only 4-6s) on the glue, automatic and continuous production of the ceramic packaging base can be realized, and the production efficiency is greatly improved.

Description

technical field [0001] The invention relates to an environment-friendly glue for screen printing and a method for lamination and lamination of ceramic raw porcelain sheets, belonging to the technical field of semiconductor manufacturing. Background technique [0002] A resonator refers to an electronic component that generates a resonant frequency. Commonly divided into quartz crystal resonators and ceramic resonators. The function of generating frequency has the characteristics of stability and good anti-interference performance, and is widely used in various electronic products. Quartz crystal resonators are mainly composed of quartz wafers, bases, shells, silver glue, silver and other components. According to the condition of the lead, it can be divided into two types: in-line (with lead) and surface mount (without lead). Common main package models are HC-49U, HC-49 / S, UM-1, UM-4, UM-5 and SMD; SMD resonators mainly use ceramic package bases. [0003] The ceramic packa...

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Problems solved by technology

[0004] At present, in the preparation of ceramic packaging bases, the bond between the green ceramic sheet and the green ceramic sheet is mainly formed by lamination hot isostatic pressing, that is, it generally needs to be under high temperature and high pressure (the high temperature and high pressure needs to be maintained for about half an hour) to make the green ceramic sheet Ceramic chips and green ceramic chips are closely bonded. The operation steps of this method are relatively complicated and inefficient. It cannot realize automatic production operations, greatly wastes labor costs, and increases artificial uncertain factors, which reduces the reliability of ceramic packaging bases. Productivity

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