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Ultraviolet light source packaging element

A technology for packaging components and ultraviolet light sources, which is applied in the direction of electrical components, semiconductor devices, circuits, etc., can solve problems such as air bubbles that cannot be eliminated, affect light extraction efficiency, and deformation of optical components, so as to achieve no air residue, improve fixation, and reduce total reflection. Effect

Pending Publication Date: 2020-03-24
QUANZHOU SANAN SEMICON TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Yet as mentioned in CN108134007A package structure, such as Figure 1(a) and 1(b) As shown, the material filled in the packaging structure is in liquid state, and there will be a problem that the air bubbles cannot be eliminated. The air bubbles exist in the airtight packaging structure, which will affect the light extraction efficiency, and the above structure also has the deformation of the optical components during the reflow soldering process. question

Method used

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  • Ultraviolet light source packaging element

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Please refer to the attached figure 2 , the present embodiment provides an ultraviolet LED packaging structure, which includes: a base frame 1, an optical element 6, and an LED chip 4; the base frame 1 has a groove in the center, and the bottom of the groove fixes the LED chip 4 ; Wherein the pedestal groove is filled with fluorine-containing resin 5, the optical element 6 falls into the groove and is located above the LED chip 4, there is a gap between the edge of the optical element 6 and the inner sidewall of the groove The gap, the gap is filled with fluorine-containing resin 5, the gap between the edge of the optical element 6 and the inner side wall of the groove realizes the elimination of air bubbles, and the fluorine-containing resin 5 covers part of the upper surface of the optical element through the gap to form a buckle effect.

[0043]Specifically, the base frame 1 is preferably an integrally formed ceramic material or a combined structure in which the bo...

Embodiment 2

[0065]As a modification of Example 1, as Figure 7 The bottom of the groove shown is provided with a continuous annular step 3 against the side wall, the height of the annular step 3 is the same, and part of the edge of the optical element 6 is placed on the step 3, and the height of the step 3 is It is greater than the height of the chip and lower than the height of the sidewall of the groove. Through the setting of the step height, the distance between the chip and the optical element can be effectively controlled, so that the light emitting angle can be effectively controlled to radiate at an angle close to the vertical as far as possible. An adhesive layer is formed between the optical element and the step, and the material of the adhesive layer is the same as or different from that of the fluororesin, or the adhesiveness of the adhesive layer is higher than that of the fluororesin. The adhesive layer here can be made of one or more layers of materials. The edge of the op...

Embodiment 3

[0067] This embodiment provides an ultraviolet light source package element different from the previous embodiment, such as Figure 8 As shown, it includes: a base frame 1, an optical element 6 and an LED chip 4; the base frame 1 has a groove in the center, and the bottom of the groove fixes the LED chip 4; the edge of the optical element 6 is placed on the On the step in the groove of the base frame, the optical element preferably has a platform on the edge, the platform is placed on the step, an adhesive layer is arranged between the platform and the step, and the adhesive force of the adhesive layer is preferably higher than that of the fluorine-containing resin, The fluorine-containing resin 5 fills the groove of the base frame, the optical element has a hole 8, and the fluorine-containing resin fills the hole and covers the outer surface around the hole. Through the fluorine-containing resin overflow hole, the snap action between the optical element and the fluorine-conta...

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Abstract

An ultraviolet light source packaging element comprises a base frame, an optical element and an LED chip. A groove is formed in the center of the base frame, and the LED chip is fixed at the bottom inthe groove; the groove part below the optical element is filled with the fluorine-containing resin, which covers part of the upper surface the optical element by filling a through hole structure in the optical element or a gap formed between the edge of the optical element and the inner side wall of the groove. The through hole structure in the optical element or the gap formed between the edge of the optical element and the inner side wall of the groove is filled to cover part of the upper surface of the optical element; on one hand, the fluorine-containing resin is put into a packaging bodyin a liquid form, gas generated in the curing process can be discharged through the through hole and the gap, and residual bubbles are avoided as much as possible; on the other hand, the fluorine-containing resin covers part of the outer surface of the optical element to form a buckling effect, and the reliability is improved.

Description

technical field [0001] The invention relates to an ultraviolet light source packaging component, in particular to an ultraviolet LED light source packaging component. Background technique [0002] A light-emitting diode (LED for short) is a solid semiconductor light-emitting device. With the development of LED technology, the wavelength band of LED modules is gradually developing towards near-ultraviolet or even deep-ultraviolet. As we all know, as a new generation of green light source, ultraviolet LED has many advantages such as high luminous efficiency, long life, energy saving, environmental protection, etc., and its application fields are becoming more and more extensive, such as indoor and outdoor disinfection, backlight, UV printing, medical treatment, catering , plant growth, etc. However, the current ultraviolet (UV) LED packaging structure, especially the deep ultraviolet (DUV) LED packaging structure generally adopts all-inorganic packaging. The light of this pa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/56H01L33/58
CPCH01L33/48H01L33/56H01L33/58Y02P60/14
Inventor 时军朋林秋霞黄永特余长治
Owner QUANZHOU SANAN SEMICON TECH CO LTD
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