Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Ceramic surface pattern machining method, ceramic and electronic equipment shell

A processing method and ceramic surface technology, applied in metal processing equipment, technology for producing decorative surface effects, welding equipment, etc., can solve problems such as quality defects and low manufacturing precision, so as to increase market share and improve aesthetics , Excellent masking effect

Active Publication Date: 2020-03-27
DONGGUAN XINBO STRUCTURAL CERAMICS CO LTD
View PDF7 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a ceramic surface pattern processing method, ceramics and electronic equipment casing, to solve the problems of low manufacturing precision and easy quality defects in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ceramic surface pattern machining method, ceramic and electronic equipment shell

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] In order to enable those skilled in the art to better understand the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described implementation Examples are only part of the embodiments of the present application, not all of them. Based on the embodiments in the embodiments of the present application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the embodiments of the present application.

[0030] see figure 1 , the present embodiment provides a ceramic surface pattern processing method, comprising steps:

[0031] Step 101, process the surface to be processed of the ceramic workpiece into a mirror surface, and then clean it.

[0032] Among them, according to the processin...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
tensile strengthaaaaaaaaaa
Login to View More

Abstract

The invention relates to the field of ceramic and discloses a ceramic surface pattern machining method, ceramic and an electronic equipment shell. The method comprises the steps that a protecting filmis attached to the surface of a ceramic workpiece, and performance parameters of the protecting film include the thickness being 80+ / -5 micrometers, viscous force being 300 g / 25 mm, the tensile strength being larger than or equal to 55 MPa, and the hot-shrinkage rate being smaller than or equal to 25%; on the to-be-machined face, laser cutting operation is carried out according to a preset cutting path, the preset cutting path is a boundary of a pattern area and a non-pattern area, and the cutting depth is no smaller than the thickness of the protecting film; the protecting film covering thepreset pattern area is removed; the to-be-machined face is subjected to sand blasting treatment until the preset pattern area is formed into a sand face with the preset roughness; and the remaining protecting film is removed. According to the method, the protecting film applied to the ceramic workpiece is designed and manufactured according to the special performance parameters, meanwhile, the laser cutting and sand blasting technology is utilized, pattern manufacturing of high-hardness ceramic surfaces is achieved, and higher machining precision and machining quality are achieved.

Description

technical field [0001] The invention relates to the technical field of ceramic products and preparation techniques thereof, in particular to a pattern processing method for ceramic surfaces, ceramics and electronic equipment casings. Background technique [0002] Ceramic materials are a kind of inorganic non-metallic materials made of natural or synthetic compounds through forming and high-temperature sintering. It has stable physical and chemical properties such as corrosion resistance, wear resistance, and high temperature resistance. In recent years, it has been widely used in Household, metallurgy, machinery, chemical industry, electronics, aerospace and medical and other fields. [0003] Among many ceramic materials, compared with ordinary ceramics, zirconia ceramics have better density, flexural strength, fracture toughness, hardness and wear resistance, but it is difficult to make complex patterns on the surface, which restricts oxidation to a certain extent. Applica...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/362C04B41/91B44C1/22
CPCB23K26/362B23K26/38B44C1/22B44C1/221B44C1/228C04B41/91
Inventor 刘星戴光宇陈兰桂彭朝阳
Owner DONGGUAN XINBO STRUCTURAL CERAMICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com