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Method for reducing breakage rate of silicon slices

A technology for wire breakage and silicon slicing, which is used in grinding machine tools, metal processing equipment, manufacturing tools, etc., to reduce wire breakage, reduce the number of back-and-forth switching, and improve slicing yield.

Inactive Publication Date: 2020-03-31
SHANGHAI SHENHE THERMO MAGNETICS ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Aiming at the problems existing in the prior art, the present invention provides a method for reducing the wire breakage rate of silicon slices to solve the problem of the yield rate of silicon slices

Method used

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  • Method for reducing breakage rate of silicon slices
  • Method for reducing breakage rate of silicon slices
  • Method for reducing breakage rate of silicon slices

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Experimental program
Comparison scheme
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Embodiment 1

[0023] A method for reducing the wire breakage rate of silicon slices, comprising:

[0024] Step 1, prepare a steel wire, wind the steel wire on the I-shaped wheel 1, the diameter of the I-shaped wheel is 208, and the wire spacing of the steel wire is 0.3mm;

[0025] Step 2, performing high-speed reciprocating motion on the steel wire;

[0026] Step 3, through the high-speed reciprocating motion of the steel wire, the abrasive is brought into the processing area for grinding;

[0027] Step 4, obtaining the product silicon slice.

[0028] The existing steel wire winding spacing is 0.6mm, the steel wire breakage rate is 3.2%, and the yield rate is 1.5%. At 0.3mm, the broken line rate is the lowest in this value range, and the yield rate is high. While ensuring the hardness, the cost of steel wire is low, which is suitable for mass use.

[0029] When the diameter of the I-shaped wheel is 200 and the spacing of the steel wires is 0.6, 0.5, 0.4, 0.3 when other process condition...

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Abstract

The invention provides a method for reducing the breakage rate of silicon slices. The method comprises the following steps that step one, a metal wire is prepared and wound on an I-shaped wheel of a diameter of 200-208 mm, with the wire spacing being 0.3-0.6 mm; step two, the metal wire is subjected to high-speed reciprocating motion; step three, an abrasive is brought into a machining area for grinding through the high-speed reciprocating motion of the metal wire; and step four, products, namely the silicon slices, are obtained.

Description

technical field [0001] The invention relates to the field of crystal silicon slices, in particular to a method for reducing the wire breakage rate of silicon slices. Background technique [0002] The production of crystalline silicon solar modules includes crystalline silicon production, ingot casting / pulling, slicing, cell production and module production. Since the current cost of solar silicon wafer power generation is still high, it has no competitive advantage compared with traditional energy sources, so it wants to develop The solar power generation industry needs to reduce costs in all aspects to achieve photovoltaic parity. The slicing link is the process of cutting the silicon ingot into thin slices. The slicing is to bring the SIC abrasive into the processing area (silicon rod) through the high-speed reciprocating motion of the metal wire for grinding. The wire breakage rate directly affects the silicon slice yield. Line rate is already the most critical factor af...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/34
CPCB24B37/345
Inventor 蔡健华贺贤汉
Owner SHANGHAI SHENHE THERMO MAGNETICS ELECTRONICS CO LTD