Manufacturing method of potting mold
A technology for potting molds and manufacturing methods, which is applied to household appliances, other household appliances, household components, etc., can solve the problem of affecting the moisture resistance and surface withstand voltage capability of potting parts, increasing tooling costs and production costs, and inability to disassemble. problems, to achieve the effect of improving production efficiency and the application range of potting glue, increasing the reuse rate, and avoiding production delays
Inactive Publication Date: 2020-04-03
XINXIANG AVIATION IND GROUP
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Problems solved by technology
Using this method will destroy the dense thin layer between the potting parts, affect the moisture resistance and surface voltage resistance of the potting part, and increase the tooling cost and production cost
There are gaps in the combined potting mold made of metal materials, resulting in uneven end faces and bubbles inside the product after potting
The potting glue is bonded together with nylon and metal mold materials after contact, and cannot be disassembled, and the surface coating of the parts is damaged after cutting
Method used
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Embodiment Construction
[0012] Below in conjunction with accompanying drawing and embodiment the present invention will be further described:
[0013] A coil usually refers to a ring-shaped wire winding. The coil is wound on the iron core according to the technical parameter requirements, and is defined as a stator assembly or a rotor assembly according to different motor mechanisms. Due to the increasingly high requirements for the flame retardancy, insulation and safety of the product, the product is potted with epoxy resin. Components are usually welded on the circuit board. After the components are soldered, the components are prevented from shifting to cause changes in the received signal, and at the same time, the insulation of the product is improved. Therefore, the components are potted with epoxy resin.
[0014] Taking the winding potting as an example, the coil is wound on the iron core according to the technical parameters. The enameled wire is not allowed to be scratched during winding an...
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The invention belongs to the field of mechanical structure design, and relates to a manufacturing method of a potting mold. The manufacturing method is characterized by comprising the following specific steps of 1, blending and curing a silicone rubber material according to the use parameters of a silicone rubber material; 2, manufacturing a potting sample which is consistent with the size of theproduct after encapsulation; 3, carrying out reverse molding on the silicon rubber material to obtain a customized pouring mold; and 4, pouring the product by using a potting mold and a potting adhesive material. By the adoption of the method, product customization and encapsulation can be realized, product coating scratching caused by product remachining is avoided, consistency of product fillingand sealing is guaranteed, mold machining cost is reduced, repeated use rate of the tool is improved, production efficiency is improved, the application range of the pouring sealant is improved, andproduction delay is avoided.
Description
technical field [0001] The invention belongs to the field of mechanical structure design and potting mold field, in particular to a potting mold design and its normal potting method, in particular to a winding or component potting mold and its potting method. Background technique [0002] Epoxy resin potting treatment of the product not only strengthens the integrity and avoids direct exposure of components and windings, but also improves the impact resistance, enhances the insulation between windings, and improves the waterproof and moisture-proof capabilities of the product. Due to the influence of materials, processes and other factors, the accuracy of direct potting is not high, and the method of potting first and then cutting is usually used. This method will destroy the dense thin layer between the potting parts, affect the moisture resistance and surface voltage resistance of the potting part, and increase the cost of tooling and production. There are gaps in the com...
Claims
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Patent Timeline
Login to View More IPC IPC(8): B29C33/38B29C39/10B29C39/26B29L31/34
CPCB29C33/3842B29C39/10B29C39/26B29L2031/34
Inventor 王梦梦李资浩侯常亮王会敏王绍飞赵学敏马丽娜张景一姬经魁
Owner XINXIANG AVIATION IND GROUP