Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Host shell material for computer and preparation method thereof

A host shell and computer technology, applied in the field of computer materials, can solve the problems of particularly serious dust contamination and heat generation of the host, and achieve the effects of increasing hardness and willfulness, removing peculiar smell, and not easily getting dust.

Inactive Publication Date: 2020-04-10
西安居正知识产权运营管理有限公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the popularity of computers, computers have become a regular daily necessities for every household. Whether it is study, work or life, the host computer is indispensable as an auxiliary tool for the computer. The host computer is used as a shell to protect the computer hardware. Power supply and other components, at present, most of the existing host materials are resin materials, and the resin material is relatively light, which is conducive to reducing the weight of the host and internal components, but sometimes it is necessary to move and move the dosage form of the host, and the resin material appears at this time. It is a bit brittle, and the host computer is placed far away from people, and it is particularly serious to be stained with dust, and once the computer is used for a long time, its heat will be serious. At this time, a host material with good thermal conductivity, good toughness, and strong rigidity is needed.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0027] A preparation method for a host computer shell material, which is specifically carried out according to the following steps:

[0028] Step 1. Weigh respectively according to mass percentage: 40-50% of diatomite, 15-20% of acrylonitrile-styrene copolymer, 5-10% of graphene, 2-5% of glass fiber, 2-5% of coupling agent %, 10-20% of calcium fluoride, 3-8% of rose powder, and 2-5% of crosslinking agent, the sum of the mass percentages of the above components is 100%.

[0029] Step 2. Grind the diatomite and calcium fluoride weighed in step 1 through a 100-200 mesh sieve respectively, and then mix the diatomite powder, calcium fluoride powder, acrylonitrile styrene copolymer, crosslinking agent, The coupling agent and graphene are mixed evenly, placed in a mixer and stirred for 10-20 minutes at a speed of 100-300 r / min, and then put into an oven for drying for 4-5 hours, and the temperature of the oven is 80-100°C.

[0030] Step 3. Pass the rose powder through a 5-10 mesh si...

Embodiment 1

[0034] A preparation method for a host computer shell material, which is specifically carried out according to the following steps:

[0035] Step 1. Weigh respectively according to mass percentage: 40% of diatomite, 20% of acrylonitrile styrene copolymer, 5% of graphene, 5% of glass fiber, 5% of trimethyl aluminate, 10% of calcium fluoride, Rose powder 8%, two (tert-butylperoxycymene) benzene 5%, the sum of the mass percentages of the above components is 100%.

[0036] Step 2. Grind the diatomite and calcium fluoride weighed in step 1 respectively through a 100-200 mesh sieve, then mix the diatomite powder, calcium fluoride powder, acrylonitrile styrene copolymer, bis(tert-butyl Peroxyisopropyl) benzene, trimethyl aluminate and graphene were mixed evenly, placed in a blender and stirred for 10 min at a speed of 100 r / min, and then dried in an oven for 4 hours at a temperature of 80°C.

[0037] Step 3. Pass the rose powder through a 5-10 mesh sieve, mix it evenly with the glas...

Embodiment 2

[0040] A preparation method for a host computer shell material, which is specifically carried out according to the following steps:

[0041] Step 1. Weigh respectively according to mass percentage: diatomite 45%, acrylonitrile styrene copolymer 17%, graphene 10%, glass fiber 3%, triisopropyl aluminate 3%, calcium fluoride 15% , rose powder 5%, two (tert-butylperoxyisopropyl) benzene The sum of the mass percentages of the components above 2% is 100%.

[0042] Step 2, the diatomite and calcium fluoride weighed in step 1 are ground respectively through a 150 mesh sieve, and then the diatomite powder, calcium fluoride powder, acrylonitrile styrene copolymer, bis(tert-butyl peroxy Isopropyl) benzene, triisopropyl aluminate and graphene were mixed evenly, placed in a blender and stirred for 15 min at a rate of 200 r / min, and then dried in an oven for 4.5 h at a temperature of 90°C.

[0043] Step 3. Pass the rose powder through a 5-10 mesh sieve, mix it evenly with the glass fiber, ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a host shell material for a computer, which is prepared from the following components in percentage by mass: 40 to 50 percent of diatomite, 15 to 20 percent of butyronitrile styrene copolymer, 5 to 10 percent of graphene, 2 to 5 percent of glass fiber, 2 to 5 percent of coupling agent, 10 to 20 percent of calcium fluoride, 3 to 8 percent of rose powder and 2 to 5 percent ofcross-linking agent, totaling 100 percent. The host material is prepared by the following steps: uniformly mixing and stirring diatomite, calcium fluoride, a butyronitrile-styrene copolymer, a cross-linking agent, a coupling agent and graphene, and drying in a drying oven, sieving the rose powder with a 5-10-mesh sieve, uniformly mixing the sieved rose powder with glass fibers, and mixing the obtained mixture in an internal mixer, and granulating and drying the obtained mixture, adding into an injection molding machine, and molding to obtain the finished product. The mainboard provided by theinvention has good thermal conductivity, is not easy to be stained with dust, has good mechanical resistance, is simple in preparation method, and can be produced on a large scale.

Description

technical field [0001] The invention belongs to the field of computer materials, and in particular relates to a host shell material used for computers, and also relates to a preparation method of the host material. Background technique [0002] With the popularity of computers, computers have become a regular daily necessities for every household. Whether it is study, work or life, the host computer is indispensable as an auxiliary tool for the computer. The host computer is used as a shell to protect the computer hardware. Power supply and other components, at present, most of the existing host materials are resin materials, and the resin material is relatively light, which is conducive to reducing the weight of the host and internal components, but sometimes it is necessary to move and move the dosage form of the host, and the resin material appears at this time. It is a bit brittle, and the host computer is particularly serious in dust stains when it is placed away from p...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C04B26/10G06F1/18C04B111/92
CPCC04B26/10C04B2111/92G06F1/18C04B14/08C04B14/024C04B14/42C04B22/126C04B18/248C04B24/045C04B24/00C04B24/40C04B24/128
Inventor 崔璐意
Owner 西安居正知识产权运营管理有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products