A production device for electric spark deposition diamond wire saw wire

A technology of electric spark deposition and diamond wire saw, which is used in grinding devices, electrophoretic plating, electrolytic coatings, etc., can solve the problems of low abrasive grain holding force, poor sawing ability, complex production process, etc., to improve abrasive grains. The effect of holding force, high production efficiency and high bonding strength

Active Publication Date: 2020-09-25
SHANDONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the abrasive grains of the consolidated abrasive wire saw wire are mainly fixed by resin bond and electroplating. The resin bond is used for bonding, and the holding force of the abrasive grain is low, and the sawing ability is poor, which affects the use of the wire saw wire. Scope: The electroplating method is adopted. At present, the suspension sanding process is mostly used, that is, the wire saw wire matrix is ​​placed in the medium liquid for electroplating, and the abrasive grains are consolidated on the wire saw wire matrix by electroplating. The abrasive grains are held better than resin bonding. , but the production process is complicated, the equipment is expensive, and the volatilization and emission of the plating solution have an impact on the environment

Method used

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  • A production device for electric spark deposition diamond wire saw wire
  • A production device for electric spark deposition diamond wire saw wire
  • A production device for electric spark deposition diamond wire saw wire

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Embodiment Construction

[0017] The technical solutions protected by the present invention will be described below using specific embodiments and accompanying drawings.

[0018] It can be seen from the accompanying drawings that the electric discharge deposition diamond wire saw wire production device of this program includes: a liquid supply device for providing a mixed liquid medium; a liquid spray electrode 5 for spraying liquid deposition on the wire saw wire substrate 18, The liquid spray electrode 5 is connected with the pulse power supply 4; the liquid spray electrode 5 is connected with the liquid supply device, and the electric spark deposition device is arranged on the rotating device; the translation device for promoting the liquid spray electrode 5 to move is arranged on the rotating device, The rotating device is also provided with a swinging device for driving the liquid spraying electrode 5 to swing. The middle part of the liquid spraying electrode is provided with a liquid flow channel,...

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PUM

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Abstract

The invention provides a production device for electric spark deposition diamond wire saw wire, comprising: a liquid supply device; an electric spark deposition device for spraying and depositing liquid on the wire saw wire substrate; a pulse power supply for supplying power to the electric spark deposition device, The electric spark deposition device is connected with the liquid supply device, the pulse power supply is connected with the electric spark deposition device, and the electric spark deposition device is arranged on the rotating device; The translation device is also provided with a swing device for driving the electric spark deposition device to swing on the rotation device. The device can realize the electric spark deposition and consolidation of diamond abrasive grains at the set position of the wire saw wire matrix, and manufacture diamond wire saw wires with orderly arrangement of abrasive grains.

Description

technical field [0001] The invention relates to the field of wire saw wire production with consolidated abrasive grains, in particular to a production device that uses an electric spark deposition process to consolidate abrasive grains such as diamond on a wire saw wire substrate. Background technique [0002] Consolidated abrasive wire saw wire is a kind of wire saw wire made by using diamonds as abrasive grains and consolidating the abrasive grains on the wire saw wire substrate. Due to its high slice quality, high cutting efficiency, narrow kerf and environmental pollution It has a broad application prospect in the field of crystal sawing. [0003] At present, the abrasive grains of the consolidated abrasive wire saw wire are mainly fixed by resin bond and electroplating. The resin bond is used for bonding, and the holding force of the abrasive grain is low, and the sawing ability is poor, which affects the use of the wire saw wire. Scope: The electroplating method is ad...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C26/02
CPCC23C26/02B24B27/0633B24D18/0018C25D13/02C25D13/18C25D15/00
Inventor 毕文波葛培琪
Owner SHANDONG UNIV
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