Coarsening micro-etching liquid of sulfuric acid and hydrogen peroxide system and application thereof

Abstract

The invention relates to a coarsening micro-etching liquid of a sulfuric acid and hydrogen peroxide system and an application thereof. The coarsening micro-etching liquid comprises sulfuric acid, hydrogen peroxide, a corrosion inhibitor, halide ions, a complexing agent and water. The coarsening micro-etching liquid of a sulfuric acid and hydrogen peroxide system is low and stable in micro-etchingrate in the micro-etching process, the copper ion capacity is high, the board surface roughness is uniform after micro-etching, blackening is avoided, a dry membrane and a copper surface can be more tightly combined, and the reject ratio of circuit manufacturing is greatly reduced. The preparation method is simple to operate, low in cost, free of environmental pollution and suitable for industrialproduction.

Description

technical field [0001] The invention belongs to the technical field of chemical microetching liquid, and in particular relates to a roughening microetching liquid of a sulfuric acid hydrogen peroxide system and an application thereof. Background technique [0002] In the manufacturing process of printed circuit boards, the transfer of circuit patterns and its pretreatment are very important parts. The pre-treatment is used to treat the surface of the copper foil. There are three methods: mechanical grinding, sandblasting, and chemical micro-etching. The purpose is to make the copper foil form a rough surface, which can be closely bonded with the photosensitive resist film. , to ensure the qualified rate of line production. There are directional scratches and scratches on the copper surface after mechanical grinding. Sand blasting has poor ability to remove defects and thicker and denser oxide layers produced by the previous process. The amount of chemical microetching on ...

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Problems solved by technology

[0006] Among the types of microetching solutions, the microetching solution of the sulfuric acid hydrogen peroxide system is a superior one. It has the advantages of stable microetching rate, large copper capacity, simple post-treatment, and no pollution. Hydrogen peroxide in the hydrogen system is easy to decompose, the rate of micro-etching is uncontrollable and uneven, and the surface of the copper plate is discolored, which greatly increases the cost of materials and emissions

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