Conductive transfer film

A technology of conductive film and conductive layer, which is applied in the direction of equipment for manufacturing conductive/semiconductive layers, conductive layers on insulating carriers, circuits, etc., which can solve the problems of conductivity and transparency, which cannot be introduced, and transparent resin Problems such as barriers to bending resistance of films

Active Publication Date: 2020-04-17
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, from the viewpoint of handling, etc., there is a limit to the thickness of the transparent resin film constituting the base material, and the limit thickness of the transparent resin film becomes an obstacle to the improvement of bending resistance.
In addition, as another method of improving the bending resistance, the use of a transparent conductive film with a conductive layer composed of a conductive polymer, metal nanowire, etc. instead of a metal oxide layer that is prone to cracks is being studied. , There is a problem with transparency, and the real import cannot be realized

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0142] A polyethylene terephthalate substrate (manufactured by PANAC CO., LTD., trade name "PANA-PEEL") subjected to mold release treatment was used as a temporary support, and the following method was applied to the temporary support. A resin layer is formed.

[0143] As a binder resin, urethane-based polyfunctional acrylate A (manufactured by DIC Corporation, trade name "UNIDICELS888") and urethane-based polyfunctional acrylate B (manufactured by DIC Corporation, trade name "UNIDICELS888") were prepared. UNIDICRS28-605" is a coating composition mixed with urethane-based multifunctional acrylate A: urethane-based multifunctional acrylate B = 8:2 by weight and diluted with ethyl acetate. Use gravure The coater applied the coating composition to the release-treated surface of the above-mentioned temporary support so that the thickness after drying became 5 μm, and thereafter, the coated layer was heated at 80° C. Next, the accumulation was irradiated with a high-pressure mercur...

Embodiment 2

[0146]Let the weight ratio of urethane-based polyfunctional acrylate A and urethane-based polyfunctional acrylate B be urethane-based polyfunctional acrylate A: urethane-based polyfunctional acrylate B=2 : 8, except that, it carried out similarly to Example 1, and obtained the electroconductive film for transfer.

Embodiment 3

[0148] A polyethylene terephthalate substrate (manufactured by PANAC CO., LTD., trade name "PANA-PEEL") subjected to mold release treatment was used as a temporary support, and the following method was passed on the temporary support. method to form a liquid crystal layer.

[0149] With the following chemical formula (I) (numbers 65 and 35 in the formula represent the mol% of the monomer unit, for the sake of convenience, it is represented by a block polymer body: 20 parts by weight of the side chain type liquid crystal polymer shown in the weight average molecular weight 5000), 80 parts by weight of a polymerizable liquid crystal showing a nematic liquid crystal phase (manufactured by BASF Corporation: trade name PaliocolorLC242) and 5 parts by weight of a photopolymerization initiator (manufactured by Ciba Specialty Chemicals Inc.: trade name Irgacure907) were dissolved in 200 parts by weight of cyclopentanone to prepare Liquid crystal coating solution. Then, after apply|co...

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Abstract

Provided is a conductive transfer film capable of preventing generation of poor appearance such as hologram-like appearance. The conductive transfer film according to the present invention comprises:a temporary support; a resin layer provided so as to be peelable from the temporary support; and a conductive layer disposed directly on the resin layer, wherein the conductive layer is constituted bya metal oxide, and the hardness of the resin layer at a depth of 50 nm as measured by a nanoindentation method is 0.3 GPa or higher. In one embodiment, the thickness of the resin layer is 1-20 mcirons.

Description

technical field [0001] The present invention relates to a conductive film for transfer. Background technique [0002] Conventionally, indium-tin composite oxide layer ( Transparent conductive film of metal oxide layer (conductive layer) such as ITO layer). [0003] On the other hand, in recent years, with the advent of wearable devices, foldable devices, etc., transparent conductive films that are more flexible and have high bending resistance are required. As a method of improving bending resistance, it is conceivable to reduce the stress applied to the conductive layer by reducing the thickness of the base material. However, from the viewpoint of handling and the like, there is a limit to the thickness of the transparent resin film constituting the base material, and the limited thickness of the transparent resin film becomes an obstacle to improvement of bending resistance. In addition, as another method of improving the bending resistance, the use of a transparent con...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B9/00G06F3/041H01B5/14H01B13/00
CPCB32B9/00G06F3/041H01B5/14H01B13/00H01B13/0026G02B5/32
Inventor 中岛一裕菅原英男安藤豪彦
Owner NITTO DENKO CORP
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