Reactance matching type and distributed type integrated ultra-wideband power chip circuit
A technology of matching circuits and power chips, applied in power amplifiers, high-frequency amplifiers, etc., can solve the problems of difficult high-power and high-efficiency power amplifier chips, unable to exert the ultimate performance of the device, and poor performance of the VSWR at the input end. Power output characteristics, the effect of overcoming poor standing waves and improving overall gain
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[0024] An ultra-broadband power chip circuit that combines reactance matching and distributed structures. The structure is applied to microwave and millimeter wave ultra-broadband monolithic integrated power amplifier circuits, including a fusion design method and circuit between reactance matching and distributed structures. match structure.
[0025] The power drive unit 101 adopts a distributed structure in which N transistors are cascaded, and the power output unit 102 adopts a reactance matching junction in which N transistors are connected in parallel. Unified power-up method.
[0026] The inter-stage matching unit 103 includes a distributed structure output end matching circuit and a reactance matching structure input end matching circuit. In the distributed output circuit, the DC voltage point 111 provides voltage for the distributed drain, and is connected in parallel with the MIM capacitor 121, and then connected in series with the second microstrip line 132 to form ...
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