Processing method for preparing lodging-resistant microstructure
A processing method and microstructure technology, applied in the direction of manufacturing microstructure devices, microstructure technology, microstructure devices, etc., can solve problems such as microstructure damage, poor adhesion, and photolithography failure, so as to avoid lodging and improve The effect of connection firmness and reliable connection
Pending Publication Date: 2020-05-08
NINGBO UNIV +1
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Problems solved by technology
At present, the photolithography technology is mainly carried out in the photoresist. After the photolithography is completed, the sample is put into the developing solution for development. If the adhesion between the microstructure and the substrate is not strong during the developing process, the flow of the developing solution will Destruction of the microstructure, thereby causing lithography to fail
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[0023] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
[0024] The processing method for preparing the lodging-resistant microstructure in this embodiment specifically includes the following steps:
[0025] S1. Design the target microstructure 1 to be processed, and design the supporting microstructure 2 that is arranged under the target microstructure 1 and can have a larger contact area with the substrate, thereby forming an integrated microprocessed body model; the higher height The target microstructure 1 is prone to lodging; in this embodiment, the three-dimensional target microstructure 1 is designed in the three-dimensional design software SolidWorks, and the supporting microstructure 2 is designed using the uFAB micromachining platform supporting control software of Newport Company;
[0026] In order to reduce the processing time for the support body on the basis of ensuring good connectivi...
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Abstract
The invention relates to a processing method for preparing a lodging-resistant microstructure, which comprises the steps of preparing a target microstructure body to be processed, and simultaneously preparing a supporting microstructure body which has a larger consolidation area with a substrate and is integrated with the target microstructure body below the target microstructure body. According to the processing method for preparing the lodging-resistant microstructure, the supporting microstructure body with a larger consolidation area with the substrate is prepared below the target microstructure body at the same time, so that the connection firmness of the microstructure on the substrate is improved; especially for a target microstructure body which is small in contact area with the substrate and high in height, due to reliable connection between the supporting microstructure body and the substrate and integrated connection between the supporting microstructure body and the targetmicrostructure body, the situation that the target microstructure body falls down relative to the substrate can be effectively avoided.
Description
technical field [0001] The invention relates to a processing method for preparing lodging-resistant large-scale microstructures by using femtosecond laser two-photon polymerization technology. Background technique [0002] In recent years, with the rapid development of micro-electromechanical systems, micro-nano electronic technology, and chip manufacturing technology, how to prepare stable microstructures on substrates has attracted extensive attention. This technology has a certain reference value for the future micro-nano manufacturing technology, lithography technology, miniaturization, integration, functionalization and other devices. Compared with macro-sized objects, micro-sized objects are more brittle, have greater adhesion, and have significant scale effects, so the microstructure is easily damaged during the preparation process. At present, the photolithography technology is mainly carried out in the photoresist. After the photolithography is completed, the sampl...
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IPC IPC(8): B81C1/00B81B3/00G03F7/00G03F7/20H01L21/027
CPCB81B3/00B81C1/00142B81C1/00388G03F7/0035G03F7/2053G03F7/70716H01L21/0274
Inventor 夏锦涛陶卫东丁阿飞孟祥俊
Owner NINGBO UNIV