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[mu] LED mass transfer method

A transfer method, LED chip technology, applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of high cost, low yield, low efficiency, etc., and achieve the effect of fast transfer speed and easy operation

Active Publication Date: 2020-05-08
FUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, µLED is prepared by semiconductor processing technology and is compatible with IC technology. It has extremely high device processing accuracy and stability, can achieve ultra-high resolution, and is easy to integrate with tactile, auditory, olfactory and other sensors to achieve high-precision spatial positioning. It is considered to be the most potential next-generation display technology, but there are still many core technical difficulties, such as mass transfer technology.
[0003] At present, there are some mass transfer technologies, such as electrostatic adsorption, laser burning, robotic pick-up, multiple substrate transfer, etc. Although these methods can effectively transfer chips, they also have some problems, such as high cost, low efficiency, and yield. Low, difficult to detect and repair, etc.
Especially when it is necessary to selectively transfer some pixels in batches, the selection is generally made by scanning, which is inefficient and requires complex precision mechanical systems or scanning systems such as vibrating mirrors.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] Embodiment 1 (the light-emitting side of the ultra-high-resolution light-emitting dot matrix faces down, and it is directly transferred).

[0050] This embodiment provides a µLED mass transfer method, including the following steps:

[0051] Step S1: Arranging the µLED chips to be transferred into an array of µLED chips in an orderly manner according to a preset spacing; making the side with the contact electrode as the first surface of the µLED array, and the first surface is attached to the blue film, The other side is used as the second surface of the µLED array; specifically: provide a transparent temporary transfer substrate, use a glue coating module to evenly coat a layer of optical adhesive on one side of the substrate; provide an array of µLED chips to be transferred, µLED chips Arranged in an orderly manner at a certain distance, the µLED chip includes a first surface and a second surface oppositely arranged, the first surface is provided with a contact electro...

Embodiment 2

[0073] Embodiment 2 (the light-emitting surface of the ultra-high-resolution light-emitting dot matrix faces upward, and the stamp is transferred).

[0074] This embodiment provides a µLED mass transfer method, including the following steps:

[0075] Step S1: Arranging the µLED chips to be transferred into an array of µLED chips in an orderly manner according to a preset spacing; making the side with the contact electrode as the first surface of the µLED array, and the first surface is attached to the blue film, The other side is used as the second surface of the µLED array; specifically: provide a transparent temporary transfer substrate, use a glue coating module to evenly coat a layer of optical adhesive on one side of the substrate; provide an array of µLED chips to be transferred, press a certain The spacing is arranged in an orderly manner, the µLED chip includes a first surface and a second surface oppositely arranged, the first surface is provided with a contact electr...

Embodiment 3

[0099] Embodiment 3 (combination of blue µLED and red-green OLED).

[0100] like Figure 8 As shown, this embodiment provides a transfer process for picking up a µLED chip by using a stamp and transferring it to an OLED driving backplane. Include the following steps:

[0101] (1) Take an OLED panel prepared with red pixels 12 and green pixels 11, reserve the position of blue pixels on the panel, and leave metal contact points at the same time, and do related treatment to make the surface have mercapto 13, which is used for metal - metal-to-metal connections;

[0102] (2) Use the stamp 08 to pick up the blue µLED 02 at the desired position, the operation method and process are the same as in the second embodiment, and will not be repeated here;

[0103] (3) The µLED chip picked up by the stamp is placed on the corresponding pixel position of the OLED drive backplane after a high-precision four-dimensional displacement system and high-precision alignment, and the electrodes o...

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Abstract

The invention relates to a [mu] LED mass transfer method. The method comprises the following steps: firstly, transferring a to-be-transferred [mu] LED chip on a blue film to a temporary transfer substrate by using an optical adhesive; selecting an irradiation area by adopting an ultrahigh-resolution light-emitting dot matrix, namely the positions of the to-be-transferred mu LED chips are screened,separating the illuminated [mu] LED chips from the temporary transfer substrate, transferring the illuminated [mu] LED chips to the driving back plate, and continuously leaving the [mu] LED chips which are not illuminated on the temporary transfer substrate to wait for the next transfer, so that the batch and selective mu LED chip transfer is realized.

Description

technical field [0001] The invention relates to the field of photoelectric display design, in particular to a µLED mass transfer method. Background technique [0002] µLED (also known as Micro-LED) display is to miniaturize the traditional LED structure. The size of a single µLED chip is generally less than 50 microns, and it is combined with a CMOS or TFT drive circuit to achieve addressing control and individual drive for each pixel. display technology. µLEDs retain the advantages of traditional LEDs in materials and devices, such as high brightness, high luminous efficacy, long life, high contrast, and nanosecond-level response time. At the same time, µLED is prepared by semiconductor processing technology and is compatible with IC technology. It has extremely high device processing accuracy and stability, can achieve ultra-high resolution, and is easy to integrate with tactile, auditory, olfactory and other sensors to achieve high-precision spatial positioning. It is c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L27/15H01L33/48
CPCH01L21/67144H01L33/48H01L27/156H01L2933/0033
Inventor 周雄图翁雅恋郭太良张永爱严群吴朝兴林志贤
Owner FUZHOU UNIV
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