Heat sealing process for protection chip

Abstract

The invention relates to a heat sealing process of a waterproof protection sleeve of a protection chip, and improvement of a used high-frequency mold. The process is characterized in that a set of high-frequency mold with three sealed edges for heat sealing is manufactured according to the model and the size of a heat-sealing product; two layers of heat sealing cloths or coating oxford cloths areplaced in a stacked mode, the two surfaces coated with adhesives are attached, and primary heat sealing and three-edge sealing are conducted through a high-frequency plastic welding machine; and a protection chip is placed in a heat-sealed waterproof sleeve, and sealing of the fourth edge is completed through a hot-pressing sealing system of a vacuum packaging machine. By adopting the mold and theprocess to carry out heat sealing protection on a chip, the probability that fiber burrs are mingled at a heat sealing glue joint in a heat sealing process is greatly reduced, the phenomenon that thechip is debonded at the heat sealing joint due to extrusion is improved, the cracking problem of a waterproof jacket is solved, and the heat sealing quality is improved; and the chip is not installedin the first three-edge heat sealing process, the appropriate heat sealing cloth can be cut according to the model when the heat sealing cloth is cut, and the situation that the allowance of the heatsealing cloth is reserved due to bulging of the chip does not need to be considered, so that the cloth is saved, the trimming link of the heat sealing cloth is omitted, and the purposes of reducing the cost and improving the efficiency are achieved.

Description

technical field [0001] The invention belongs to the field of personal protection and special equipment, and relates to a heat sealing process for protective chips. Background technique [0002] A heat sealing process for protective chips is a needle-free garment processing technology. That is, hot-melt adhesive coated Oxford cloth is used, and through new electronic processing technology, a high-frequency plastic welding machine or heat sealing machine is used to generate a high-frequency electric field through an electronic self-excited oscillator, and this high-frequency electric field is applied to the electrode. Under the action of a high-frequency electric field, the molecular structure of PVC, TPU, EVA, PET, etc., the adhesive film will be polarized and generate heat by itself. After melting, it will fully penetrate into the fibers of the fabric and bond with the fiber molecules. , Form a firm bond at the edge of the chip waterproof case to achieve the purpose of hot-...

AI Technical Summary

Problems solved by technology

However, the butt joints between the fabrics are stitched with needles and threads, and there will be stitches and needle holes at the joints of the seams. Since water is pervasive, once immersed in water, water seepage will occur, and the effect of waterproof protection cannot be achieved.

In the one-time heat-sealing process, due to the high probability of fiber burr inclusions at the heat-sealing seam, the heat-sealing seam is easy to debond; at the same time, one-time heat-sealing often causes a large amount of air to accumulate in the waterproof case, and when the protective chip is squeezed , it is easy to cause the waterproof cover to leak or even crack