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LED chip with DBR insulation protection and uniform light emitting and manufacturing method thereof

A LED chip with uniform light emission technology, which is applied to electrical components, circuits, semiconductor devices, etc., can solve the problems of affecting the display effect and appearing light and dark lattices, and achieves the expansion of the high reflection spectrum range, high reflectivity, and prevention of fragmentation. Effect

Pending Publication Date: 2020-05-12
FOSHAN NATIONSTAR SEMICON
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Problems solved by technology

The front-mounted LED chips are used in backlight display applications. Due to the difference in luminous intensity between the forward and side directions, light and dark dot matrix will appear in the backlight display, which will affect the final display effect.

Method used

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  • LED chip with DBR insulation protection and uniform light emitting and manufacturing method thereof
  • LED chip with DBR insulation protection and uniform light emitting and manufacturing method thereof
  • LED chip with DBR insulation protection and uniform light emitting and manufacturing method thereof

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Embodiment Construction

[0036] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0037] see figure 1 , a kind of LED chip with DBR insulation protection provided by the present invention has a uniform light emitting LED chip, comprising a substrate 10, a light-emitting structure arranged on the front of the substrate 10, a first DBR reflective layer 30 arranged on the light-emitting structure, and a light-emitting structure arranged on the substrate 10 on the back of the second DBR reflective layer 40.

[0038] The light emitting structure of the present invention comprises a first semiconductor layer 21, an active layer 22 and a first electrode 26 disposed on the first semiconductor layer 21, a second semiconductor layer 23 disposed on the active layer 22, a second semiconductor layer disposed on the second semiconductor The current blocking...

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Abstract

The invention discloses an LED chip with DBR insulation protection and uniform light emitting and a manufacturing method thereof. The chip comprises a substrate, a light-emitting structure arranged onthe front face of the substrate, a first DBR reflecting layer arranged on the light-emitting structure, and a second DBR reflecting layer arranged on the back face of the substrate. The first DBR reflecting layer is of a single-pile structure, and the second DBR reflecting layer is of a multi-pile structure; after light emitted by the light-emitting structure is reflected by the first DBR reflecting layer and the second DBR reflecting layer, the forward light-emitting intensity and the lateral light-emitting intensity of the chip tend to be the same. Through the mutual cooperation of the first DBR reflecting layer and the second DBR reflecting layer, the upward and downward light emission of the chip is reduced, and the lateral light emission of the chip is increased, so forward and lateral light emission intensities of the chip tend to be the same. Moreover, the first DBR reflecting layer covers the front surface of the light-emitting structure and can also be used as a protective layer, so a silicon oxide insulating layer deposition process is omitted, the process time is shortened, and the manufacturing cost is saved.

Description

technical field [0001] The invention relates to the technical field of light-emitting diodes, in particular to an LED chip with DBR insulation protection and uniform light emission and a manufacturing method thereof. Background technique [0002] As a new generation of solid-state light source, LED has the advantages of energy saving, environmental protection, high light efficiency, long service life and high stability. In the field of backlight application, due to its high photoelectric conversion efficiency, small size, and environmental protection, LED is expected to gradually replace cold cathode lamps and become an important part of liquid crystal displays. When front-mounted LED chips are used in backlight display applications, due to their different luminous intensities in the forward and side directions, light and dark dot matrixes will appear in the backlight display, thereby affecting the final display effect. [0003] In addition, in order to prevent water vapor ...

Claims

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Application Information

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IPC IPC(8): H01L33/46
CPCH01L33/46H01L2933/0025
Inventor 邓梓阳崔永进范凯平仇美懿徐亮庄家铭
Owner FOSHAN NATIONSTAR SEMICON
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