Flexible circuit board and loudspeaker

Abstract

The invention provides a flexible circuit board. The section width of a first cantilever section conducting layer is gradually reduced from two ends to the middle in a first direction; the section width of the first cantilever section conducting layer is smaller than that of a second cantilever section conducting layer; therefore, the cross sectional area of the first cantilever section conductinglayer is smaller than that of the second cantilever section conducting layer located at the two ends of the first cantilever section conducting layer. The resistance of the first cantilever section conducting layer is increased, more heat is correspondingly generated, the rigidity of the first cantilever section conducting layer is reduced due to the larger heat, and the middle area of a cantilever participates in more vibration of the flexible circuit board, so that deformation of the root part can be effectively reduced, the stress of the root part is reduced, accumulation of a large amountof heat of the root part during vibration is avoided, and the fatigue life of the flexible circuit board is prolonged.

Description

technical field [0001] The invention relates to the field of acoustic technology. [0002] Specifically, it relates to a flexible circuit board and a loudspeaker. Background technique [0003] The ultra-linear speaker can greatly improve the space utilization rate and increase the vibration amplitude of the sound-generating device, so its sound quality, especially the low-frequency sound quality, can be greatly improved. In order to improve the vibration amplitude of the ultra-linear speaker vibration component, it is necessary to replace the traditional lead wire with a flexible circuit board to conduct the circuit. Thanks to the flexible circuit board is a stacked structure of copper layers wrapped with polymer materials, the outer polymer material It can well protect the inner conductive copper layer. [0004] It is difficult for a flexible circuit board with a traditional structure to pass the 168-hour reliability test. It can be found from the failure diagram that the...

AI Technical Summary

Problems solved by technology

[0004] It is difficult for a flexible circuit board with a traditional structure to pass the 168-hour reliability test. It can be found from the failure diagram that the failure location is generally the root of the flexible circuit board. The main reason is that the root of the flexible circuit board is deformed the most when it vibrates. Local deformation will cause heat to accumulate at the root. Excessively high temperature can carbonize the wrapped polymer material layer and cause cracks. The failure of the wrapped layer will cause greater stress on the copper layer, and as the temperature rises, the copper layer itself will The fatigue limit strength will also be reduced, so after a long-term reliability test, the copper layer will generate fatigue cracks at the root

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