Preparation method of circuit board with copper-based radiator
A technology for circuit boards and copper substrates, which is used in the manufacture of printed circuits, circuit covers, printed circuits, etc., to achieve the effect of good electrical insulation performance and good thermal conductivity.
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Embodiment 1
[0042]The preparation method of Example 1 includes the steps of forming a through hole through the copper substrate at a predetermined position of the flat copper substrate, and filling the through hole with insulating resin. For example, see figure 1 A through hole 111 penetrating through the copper substrate 11 is formed at a predetermined position of the flat copper substrate 11 by, for example, mechanical drilling or laser drilling. It should be noted that, figure 1 The two through holes 111 in is only a schematic representation, and the number of through holes 111 can be set as required. Such as figure 2 As shown, the insulating resin 12 is filled in the through hole 111 by a resin plugging process. Among them, the thermal expansion coefficient of the insulating resin 12 is preferably 40-80 ppm / °C (after Tg), for example, about 60 ppm / °C.
[0043] The preparation method of Example 1 includes the step of manufacturing heat-conducting copper bosses on two opposite surf...
Embodiment 2
[0052] The difference between embodiment 2 and embodiment 1 is that the preparation method of the heat-conducting copper boss is different, so the following only describes the preparation method of the heat-conducting copper boss in embodiment 2. For the description of other steps in embodiment 2, please refer to the previous implementation example 1.
[0053] The heat conduction copper boss preparation step of embodiment 2 comprises: first as Figure 14 As shown, two opposite surfaces of the copper substrate 11 are covered with an anti-plating film 102, and the anti-plating film 102 has an electroplating hole 1021 exposing the surface of the copper substrate 11 in the area for forming a heat-conducting copper boss; then as Figure 15 As shown, copper is electroplated on the surface of the copper substrate 11 in the electroplating hole 1021 to obtain a heat conducting copper boss 131 .
Embodiment 3
[0055] The difference between embodiment 3 and embodiment 1 is that the insulating substrate on the surface of the copper substrate and the arrangement of the copper foil layer are different, so only the specific arrangement of the insulating substrate and the copper foil layer in embodiment 3 will be described below. For the description of other steps in Example 3, please refer to the aforementioned Example 1.
[0056] Such as Figure 16 As shown, in embodiment 3, the copper foil layer 31' (that is, the RCC copper foil) with the resin base film 310' attached to the two opposite surfaces of the copper substrate 11 is stacked. The window 311'; the resin base film 310' is bonded to the copper substrate 11. Thus, an insulating base material and a copper foil layer are provided on both opposing surfaces of the copper substrate 11 . Among them, the thermal expansion coefficient of the resin base film is preferably 40-80 ppm / °C (after Tg).
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Abstract
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