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Optical/thermal dual-curing low-dielectricity adhesive and preparation method thereof

A low-dielectric, dual-curing technology, used in adhesives, adhesive additives, adhesive types, etc., to optimize dielectric properties, improve adhesion, and have broad prospects for application

Active Publication Date: 2020-05-22
COLLTECH DONGGUAN BONDING TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are very few adhesives with low Dk and Df on the market, and there are no adhesives that can perform light / thermal dual curing under the conditions of low Dk and Df.

Method used

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  • Optical/thermal dual-curing low-dielectricity adhesive and preparation method thereof
  • Optical/thermal dual-curing low-dielectricity adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] (1) Take by weight 20 parts of polyether-based acrylic resin, 20 parts of monofunctional fluorocarbon resin, 10 parts of ceramic powder and 10 parts of hollow glass microspheres, stir and mix for 1.5 hours to obtain mixture A;

[0026] (2) Take by weighing 15 parts of isobornyl acrylate, 25 parts of isocecyl acrylate and 1.5 parts of coupling agent A-174 by mass parts, with 15 parts of isobornyl acrylate, 25 parts of isocecyl acrylate and 1 One part of coupling agent A-174 was added to the mixture A and mixed for 2 hours to obtain a mixture B;

[0027] (3) Take by weighing 3 parts of 1-hydroxycyclohexyl benzophenone, 2 parts of tert-butyl peroxyisopropyl carbonate, 3 parts of 1-hydroxycyclohexyl benzophenone, 2 parts of isopropyl peroxide tert-butyl carbonate was added in the mixture B, mixed for 2 hours to obtain the mixture C;

[0028] (4) The mixture in step C was subjected to vacuum defoaming in a stirred tank with a vacuum degree of 750 mmHg and a defoaming time o...

Embodiment 2

[0030] (1) Take by weight 30 parts of polyether-based acrylic resin, 15 parts of monofunctional fluorocarbon resin, 10 parts of ceramic powder and 18 parts of hollow glass microspheres, stir and mix for 1.5 hours to obtain mixture A;

[0031] (2) Weigh 15 parts of isobornyl acrylate, 15 parts of lauric acrylate and 1 part of coupling agent A-174 by mass parts, and mix 15 parts of isobornyl acrylate, 15 parts of lauric acrylate and 1 part of coupling agent A-174. The joint agent A-174 was added to the mixture A, and mixed for 1.5 hours to obtain the mixture B;

[0032] (3) Weigh 1 part of 1-hydroxycyclohexyl benzophenone and 2 parts of dibenzoyl peroxide by mass parts, add 1 part of 1-hydroxycyclohexyl benzophenone and 2 parts of dibenzoyl peroxide In the mixture B, mix for 2 hours to obtain the mixture C;

[0033] (4) The mixture in step C was subjected to vacuum defoaming in a stirred tank with a vacuum degree of 750 mmHg and a defoaming time of 2 hours to obtain the light / t...

Embodiment 3

[0035] (1) Take by weight 30 parts of polyester acrylic resin, 40 parts of difunctional fluorocarbon resin, 15 parts of ceramic powder and 15 parts of hollow glass microspheres, stir and mix for 2 hours to obtain mixture A;

[0036] (2) Weigh 15 parts of dicyclopentenyl acrylate, 25 parts of isodecyl acrylate and 2 parts of coupling agent A-174 by mass parts, and mix 15 parts of dicyclopentenyl acrylate, 25 parts of isodecyl Acrylate and 2 parts of coupling agent A-174 were added to the mixture A and mixed for 1.5 hours to obtain a mixture B;

[0037] (3) Take by weighing 1 part of 1-hydroxycyclohexyl benzophenone, 2 parts of 2,4,6-trimethylbenzoyl phosphine oxide, 2 parts of tert-butyl peroxyisopropyl carbonate, and 1 part of 1-hydroxycyclohexyl benzophenone, 2 parts of 2,4,6-trimethylbenzoyl phosphine oxide, and 2 parts of tert-butyl peroxyisopropyl carbonate were added to the mixture B and mixed for 2 hours to obtain mixture C;

[0038] (4) The mixture in step C was subje...

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Abstract

The invention relates to the field of adhesives, in particular to an optical / thermal dual-curing low-dielectricity adhesive and a preparation method thereof. The adhesive is prepared from the following raw materials in parts by weight: 40-80 parts of resin, 30-50 parts of a monomer, 1-3 parts of a coupling agent, 2-5 parts of an initiator and 20-40 parts of a filler. The raw materials are preparedin a step-by-step mixing mode, a vacuum defoaming technology is combined, and the mixing time is controlled. According to the adhesive, the resin and the filler capable of providing low dielectricityare fully and uniformly mixed under the action of the coupling agent, and the initiator is matched, so that the optical / thermal dual-curing low-dielectricity adhesive is obtained. The problems of insufficient curing of a shadow part of an application end and insufficient dielectric property caused by a single curing mode of an existing adhesive are solved, and the disclosed adhesive has a wide application prospect in the field of 5G communication.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to a light / heat dual-curing low-dielectric adhesive and a preparation method thereof. Background technique [0002] Nowadays, electronic products occupy all aspects of our lives. With the development of science and technology and the progress of society, people's demand for electronic consumer products is increasing day by day, which accelerates the replacement and upgrading of electronic consumer products. Adhesive is an important part of electronic products and a key factor that restricts the performance of electronic products. Therefore, in the process of upgrading the performance of electronic products, higher requirements are put forward for the performance of adhesives. [0003] Low dielectric constant (Dk) and low dielectric loss (Df) are important parameters affecting electronic components, and are also key factors for evaluating line signal loss. The dielectric constant and dielec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J171/00C09J127/12C09J167/06C09J11/04C09J11/06
CPCC09J11/04C09J11/06C09J127/12C09J167/06C09J171/00C08L27/12C08K13/02C08K3/013C08K7/28C08K5/5425C08L71/00C08L67/06
Inventor 张宝华黄成生
Owner COLLTECH DONGGUAN BONDING TECH CO LTD