Bearing head and polishing device with same

Abstract

The invention relates to the technical field of semiconductor manufacturing process polishing, in particular to a bearing head and a polishing device with the same. The bearing head comprises a body made of a non-flexible material, wherein a plurality of concave cavities are formed in the end, close to a wafer to be polished, of the body, and a vent hole connected with an air source is formed in each concave cavity; and a flexible film is fixedly connected to the end and is suitable for making contact with the wafer to be polished. According to the bearing head, the body is made of the non-flexible material, so that a plurality of concave cavities are conveniently formed in the body; the vent holes connected with the air source are formed in the concave cavities, so that the air pressure of each concave cavity is conveniently controlled; due to the fact that the flexible film is fixedly connected to the end part, close to the wafer to be polished, of the body and is in contact with thewafer to be polished, the compactness between the flexible film and the wafer to be polished is guaranteed; and due to the fact that independent control over all the cavities is guaranteed by directly forming the cavities in the body made of the non-flexible material to be matched with the flexible film without independently arranging sealing mechanisms among all the cavities, and therefore the structure and the process manufacturing of the bearing head simpler.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing process polishing, in particular to a carrying head and a polishing device having the same. Background technique [0002] The integrated circuit manufacturing process generally refers to depositing conductors, semiconductors, and insulating layers on a specific substrate (such as a silicon-based wafer) in a certain process sequence. During the manufacturing process, the CMP (Chemical Mechanical Polishing, chemical mechanical polishing) device is mainly used to globally planarize the microscopically rough surface of the wafer after the film deposition process, so as to carry out the subsequent semiconductor process. [0003] The chemical mechanical polishing device fixes one side of the wafer on the carrier head by means of negative pressure adsorption, and makes the other side (that is, the process side) contact with the polishing pad on the polishing disc during the process th...

AI Technical Summary

Problems solved by technology

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the complex structure and difficult manufacturing process of the carrier head in the prior art, so as to provide a carrier head with a relatively simple structure and simple process manufacturing and a polishing device with it

Images