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Carrier head and polishing device with same

A bearing head and body technology, applied in the direction of grinding device, grinding/polishing equipment, manufacturing tools, etc., can solve the problems of complex structure of bearing head, difficulty in process manufacturing, etc., and achieve improved polishing effect, easy acquisition, air pressure control convenient effect

Active Publication Date: 2021-11-16
BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the complex structure and difficult manufacturing process of the carrier head in the prior art, so as to provide a carrier head with a relatively simple structure and simple process manufacturing and a polishing device with it

Method used

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  • Carrier head and polishing device with same
  • Carrier head and polishing device with same
  • Carrier head and polishing device with same

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Embodiment Construction

[0041] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0042] In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as there is no conflict with each other.

[0043] Such as Figure 2-Figure 6 As shown, this embodiment provides a carrier head, including: a body 6 and a flexible film 13 .

[0044] The body 6 is made of non-flexible material, and the body 6 is provided with a plurality of cavities near the end of the product to be polished, each cavity is provided w...

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Abstract

The invention relates to the technical field of semiconductor manufacturing process polishing, in particular to a carrier head and a polishing device having the same. The carrier head includes: a body made of non-flexible material, the end of the body close to the wafer to be polished is provided with a plurality of concave cavities, and each concave cavity is provided with a ventilation hole connected with the air source; the flexible film is fixedly connected to the end, suitable for in contact with the wafer to be polished. By setting the body to be made of inflexible material, it is convenient to open a plurality of concave cavities on the body, and a ventilation hole connected to the air source is arranged on the concave cavity, so that the air pressure control of each concave cavity is more convenient. The end of the polished wafer is fixedly connected to the flexible film, and the flexible film is used to contact the wafer to be polished to ensure the fit between the flexible film and the wafer to be polished. The non-flexible material body is used to directly open a concave cavity in the form of a flexible film to ensure the independent control of each cavity, so that the structure and process of the bearing head are relatively simple.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing process polishing, in particular to a carrying head and a polishing device having the same. Background technique [0002] The integrated circuit manufacturing process generally refers to depositing conductors, semiconductors, and insulating layers on a specific substrate (such as a silicon-based wafer) in a certain process sequence. During the manufacturing process, the CMP (Chemical Mechanical Polishing) device is mainly used to globally planarize the microscopically rough surface of the wafer after the film deposition process, so as to carry out the subsequent semiconductor process. [0003] The chemical mechanical polishing device fixes one side of the wafer on the carrier head by means of negative pressure adsorption, and makes the other side (that is, the process side) contact with the polishing pad on the polishing disc during the process through the rotation of the stati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/30B24B37/005B24B49/16
CPCB24B37/30B24B37/005B24B49/16
Inventor 徐俊成尹影蒋锡兵戴豪
Owner BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD
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