High-density service modular system based on orthogonal framework

Abstract

The invention discloses a high-density service modular system based on an orthogonal framework. The high-density service modular system include a veneer system, physical interface, the bottom plate iscomposed of a front panel interface, a back panel interface, a board-to-board interlayer connector interface and a storage interface connector, a PCIE network card chip XXV710 with double 25GE ports,a gigabit PHY chip 88E1543 with four ports, a VGA display card SM750, a CPLD, an IPMC, a clock BUFFER and a power conversion circuit are mainly arranged in the board. According to the high-density service modular system based on the orthogonal framework, the product reliability is improved and the research and development period is shortened through the CPU daughter card modular design, the simplified module interface design has wide applicability, the high-density layout is guaranteed through the small and exquisite appearance, and enough expansion space is reserved for an interface board.

Description

technical field [0001] The invention relates to the field of communication and server application technology for telecom operators and enterprise customers, and specifically relates to a high-density service modular system based on an orthogonal framework. Background technique [0002] With the rapid development of the Internet and mobile Internet, various Internet+ applications emerge in an endless stream, and the demand for network and bandwidth continues to rise. The backbone network and metropolitan area network have already used 100Gbps optical transmission, which is the mainstream of network interconnection. At the same time, the standard of the network interconnection interface is also constantly improving, according to the evolution rate of 100G→400G→800G, which puts forward higher requirements for the network processing platform. [0003] Since the traditional communication equipment structure cannot adapt to such high-bandwidth processing, in recent years, various ...

AI Technical Summary

Problems solved by technology

[0006] 1. No x86 server design experience

[0007] 2. Due to the private nature of the manufacturer's orthogonal architecture, standard general-purpose servers cannot be used

[0008] 3. The challenge of achieving large bandwidth for servers on an orthogonal architecture

[0009] Existing applications require more and more high-density servers, and traditional 2S servers can no longer meet the demand; large-scale servers have a long R&D cycle, and customer needs are differentiated, so there is an urgent need to shorten the R&D cycle

Images