Process for preventing anodic oxidation deformation of bolt bottom plate of DaVinci test socket

Abstract

The invention discloses a process for preventing anodic oxidation deformation of a bolt bottom plate of a DaVinci test socket. The process is characterized by comprising the following operation steps:step 1, reserving allowance on the bolt bottom plate before first anodic oxidation; step 2, carrying out anodic oxidation treatment on the surface of the bolt bottom plate; step 3, cutting off the allowance reserved on the bolt bottom plate, and processing the outline of the product; meanwhile, machining holes needing to be conducted; step 4, protecting all areas except the outer contour edge ofthe product by using a high-temperature-resistant and acid-corrosion-resistant adhesive tape; step 5, carrying out secondary anodic oxidation treatment; the processis simple in process and convenientto operate; the influence of heat generated by anodic oxidation treatment on the positions of the pin mounting holes is effectively reduced, the change of the shapes and the positions of the small holes can be effectively reduced or avoided, the quality stability in the product technological process is ensured, and mass production becomes possible.

Description

technical field [0001] The invention relates to the field of da Vinci test sockets, in particular to a technique for preventing anodic oxidation deformation of a pin bottom plate of a da Vinci test socket. Background technique [0002] In the field of IC testing, the traditional use of composite plastics to make spring probe sockets provides limited bandwidth capabilities during testing, and the manufacturing process and difficulty are very complicated. Da Vinci test socket changes the traditional process, uses aluminum alloy as the base of the product, and then through partial or overall anodic oxidation treatment, uses the good conductivity of aluminum alloy itself and the insulation of aluminum oxide to meet the requirements of the test process for equipment functions. It avoids the loss of test frequency caused by inserting conductive leads on the plastic substrate in the past, and realizes a more accurate test of chip operating frequency. But at the same time, limited ...

AI Technical Summary

Problems solved by technology

But at the same time, limited by the size of the chip, the pin top plate is usually designed to have a thickness of about 4mm, a length and width of about 60mm, and a structure densely covered with small holes. During the process, there will be obvious deformation, and the position and shape of the small hole will change, which will affect the assembly accuracy and function, and even cause damage to the test pins

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