Server cooling system combining server chip gravity type heat pipe and heat pipe back plate

A chip heat dissipation and heat dissipation system technology, which is applied in cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve the problems of low energy efficiency utilization and high PUE value of data centers

Pending Publication Date: 2020-06-12
四川澄观节能环保科技有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The energy consumption of data center air conditioners accounts for 35%-45% of the total energy consumption of the computer room, second only to

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Server cooling system combining server chip gravity type heat pipe and heat pipe back plate
  • Server cooling system combining server chip gravity type heat pipe and heat pipe back plate
  • Server cooling system combining server chip gravity type heat pipe and heat pipe back plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0054] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in combination with specific embodiments and with reference to the accompanying drawings. It should be understood that these descriptions are exemplary only, and are not intended to limit the scope of the present invention. Also, in the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concept of the present invention.

[0055] Such as figure 1 Shown is a schematic diagram of a server heat dissipation system combined with a server chip gravity heat pipe and a heat pipe backplane, including a mechanical refrigeration unit 2, a natural cooling unit 1, a system voltage stabilization unit 3, a pressure sensor 4, a temperature sensor 5, and a mechanical refrigeration pump unit 6 , natural cooling pump unit 7, heat pipe backplane cooling distr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a server cooling system combining a server chip gravity type heat pipe and a heat pipe back plate, which realizes server chip-level heat dissipation by arranging a gravity type heat pipe chip radiator in a data center, optimizes airflow organization, and avoids the phenomena of local high temperature and local heat island of a server cabinet caused by uneven airflow. Auxiliary heat dissipation is conducted through the heat pipe backboard heat dissipation unit, so the space utilization efficiency of the data center is effectively improved, more servers can be arranged,economic benefits are improved, and the purpose of saving energy is achieved. The server cooling system has the characteristics of high heat exchange efficiency, low heat resistance, low energy consumption, high heat exchange response speed, high reliability, low noise, long service life and the like; through the combination of a chip-level cooling technology and an outdoor cooling unit, more reasonable and efficient heat dissipation is directly carried out on the server chip; through the combination of a heat pipe backboard cooling technology and an outdoor refrigeration unit, more reasonableand efficient heat dissipation is directly carried out on other heat sources except the server chip.

Description

technical field [0001] The invention relates to the technical field of environment control in a computer room of a data center, in particular to a server heat dissipation system combined with a server chip gravity type heat pipe and a heat pipe backplane. Background technique [0002] my country's data centers are developing rapidly, with a total of more than 400,000. The annual power consumption exceeds 1.5% of the electricity consumption of the whole society. It is estimated that the energy consumption of data centers will be equivalent to the annual power generation of the Three Gorges Power Station. The PUE is still generally greater than 2.2, which is far behind the international advanced level. The IT equipment of the data center needs to be cooled around the clock. Usually, precision air conditioners are used for cooling in the computer room, so as to ensure the environmental control requirements of the data center. The energy consumption of data center air conditione...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K7/20
CPCH05K7/20763H05K7/208
Inventor 朱建斌王丁会严峰王建波杨英
Owner 四川澄观节能环保科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap