A kind of target material sputtering equipment and target material sputtering system
A target and sputtering technology, applied in the field of coating equipment, can solve the problems of large floor space, many auxiliary system components, complex structure, etc., and achieve the effect of small floor space, low control difficulty, and few auxiliary system components
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no. 1 example
[0043] see in conjunction Figure 1 to Figure 3 , the present embodiment provides a target sputtering device 100, including a sputtering process area 110 and a target placement area 130, a target fixture 111 and a chip tray 113 are arranged in the sputtering process area 110, and the target is fixed Component 111 is arranged on the top of the chip tray 113, and the target placement area 130 is provided with at least one carrier block 131 for carrying the target, and the carrier block 131 is movably moved from the target placement area 130 to the sputtering process area 110 so that The target is positioned on the target holder 111 .
[0044] In this embodiment, both the sputtering process area 110 and the target placement area 130 are set in the same reaction housing, and the reaction housing is sealed compared to the outside world and connected to an external pump auxiliary system. The interior of the reaction shell is in a high vacuum state, thereby preventing the gas and wa...
no. 2 example
[0060] see in conjunction Figure 4 with Figure 5 , this embodiment provides a target sputtering device 100, its basic structure and principle and the technical effects produced are the same as those of the first embodiment, for a brief description, for the part not mentioned in this embodiment, please refer to the first Corresponding content in the embodiment. Compared with the first embodiment, the difference of this embodiment lies in the bearing block 131 .
[0061] The target material sputtering equipment 100 comprises a sputtering process area 110, and a target material holder 111 and a loading plate 113 are arranged in the sputtering process area 110. The equipment 100 also includes a target placement area 130, the target placement area 130 is provided with at least one carrying block 131 for carrying the target, and the carrying block 131 can move from the target placement area 130 to the sputtering process area 110 so that the The target is positioned on the targe...
no. 3 example
[0066] see Image 6 , this embodiment provides a target sputtering device 100, its basic structure and principle and the technical effects produced are the same as those of the first embodiment, for a brief description, for the part not mentioned in this embodiment, please refer to the first Corresponding content in the embodiment. Compared with the first embodiment, the difference of this embodiment lies in the bearing block 131 .
[0067] The target material sputtering equipment 100 comprises a sputtering process area 110, and a target material holder 111 and a loading plate 113 are arranged in the sputtering process area 110. The equipment 100 also includes a target placement area 130, the target placement area 130 is provided with at least one carrying block 131 for carrying the target, and the carrying block 131 can move from the target placement area 130 to the sputtering process area 110 so that the The target is positioned on the target holder 111 .
[0068] The sidew...
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