A novel protective film containing heat-reducing adhesive and its preparation method
A protective film and adhesive technology, which is applied in the field of new protective film containing heat-reduced adhesive and its preparation, can solve the problems that it is not easy to achieve peel strength, damage components, etc., and achieve adhesiveness, high adhesiveness, high The effect of peel strength
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[0028] The preparation method of the above-mentioned adhesive layer is as follows: firstly stir the expansion material and the solvent for 20-30 minutes, then add the curing agent and the resin and stir for 20-30 minutes to obtain the product.
[0029] Preferably, the preparation method of above-mentioned adhesive layer is:
[0030] (1) First mix the acrylate monomer, dicarboxylic acid and 1 / 2 weight solvent, then stir at 70-75°C for 6-8 hours;
[0031] (2) Stir the swelling material with the remaining 1 / 2 weight of the solvent for 20-30 minutes, then add the curing agent and stir the material obtained in step (1) for 20-30 minutes to obtain the product.
[0032] In one embodiment, the thickness of the adhesive layer is 20-45 μm.
[0033] In one embodiment, the thickness of the substrate layer is 30-60 μm.
[0034] The base material layer of the present invention can be selected from the materials of those skilled in the art resin, such as but not limited to: low-density polye...
Embodiment 1
[0037] Embodiment 1 of the present invention provides a novel protective film containing a heat-relieving adhesive, including a substrate layer and an adhesive layer; the adhesive layer includes the following raw materials in parts by weight: 36 parts of resin, 1 part of curing agent, 3 parts of thermal expansion material and 32 parts of solvent;
[0038] The resin is an acrylate resin, and the raw materials for the preparation of the acrylic resin include acrylate monomers and dicarboxylic acids; the molar ratio of acrylate monomers to dicarboxylic acids is 1:0.55;
[0039] The acrylate monomers are 2,3-dihydroxypropyl acrylate and butyl acrylate, and the molar ratio of 2,3-dihydroxypropyl acrylate to butyl acrylate is 1:3.2;
[0040] The dicarboxylic acid substance is 1,4-butanedioic acid;
[0041] The curing agent is 2,4-toluene diisocyanate;
[0042] Solvent is ethyl acetate;
[0043] Expancel series of expanded microspheres are used as thermal expansion materials;
[...
Embodiment 2
[0051] Embodiment 2 of the present invention provides a novel protective film containing a heat-reducing adhesive, including a substrate layer and an adhesive layer; the adhesive layer includes the following raw materials in parts by weight: 52 parts of resin, 4.8 parts of curing agent, 10 parts of thermal expansion material and 49 parts of solvent;
[0052] The resin is an acrylate resin, and the raw materials for the preparation of the acrylic resin include acrylate monomers and dicarboxylic acids; the molar ratio of acrylate monomers to dicarboxylic acids is 1:0.8;
[0053] The acrylate monomers are 2,3-dihydroxypropyl acrylate and butyl acrylate, and the molar ratio of 2,3-dihydroxypropyl acrylate to butyl acrylate is 1:4.8;
[0054] The dicarboxylic acid substance is 1,4-butanedioic acid;
[0055] The curing agent is 2,4-toluene diisocyanate;
[0056] Solvent is ethyl acetate;
[0057] Expancel series of expanded microspheres are used as thermal expansion materials;
...
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Abstract
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