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A novel protective film containing heat-reducing adhesive and its preparation method

A protective film and adhesive technology, which is applied in the field of new protective film containing heat-reduced adhesive and its preparation, can solve the problems that it is not easy to achieve peel strength, damage components, etc., and achieve adhesiveness, high adhesiveness, high The effect of peel strength

Active Publication Date: 2022-02-18
广东硕成科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing technology has not yet achieved very good peelability, and damage to components still occurs from time to time, and it is not easy to achieve high peel strength during fixing, but it is easy to peel at a lower temperature without residual glue. technical effect

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0028] The preparation method of the above-mentioned adhesive layer is as follows: firstly stir the expansion material and the solvent for 20-30 minutes, then add the curing agent and the resin and stir for 20-30 minutes to obtain the product.

[0029] Preferably, the preparation method of above-mentioned adhesive layer is:

[0030] (1) First mix the acrylate monomer, dicarboxylic acid and 1 / 2 weight solvent, then stir at 70-75°C for 6-8 hours;

[0031] (2) Stir the swelling material with the remaining 1 / 2 weight of the solvent for 20-30 minutes, then add the curing agent and stir the material obtained in step (1) for 20-30 minutes to obtain the product.

[0032] In one embodiment, the thickness of the adhesive layer is 20-45 μm.

[0033] In one embodiment, the thickness of the substrate layer is 30-60 μm.

[0034] The base material layer of the present invention can be selected from the materials of those skilled in the art resin, such as but not limited to: low-density polye...

Embodiment 1

[0037] Embodiment 1 of the present invention provides a novel protective film containing a heat-relieving adhesive, including a substrate layer and an adhesive layer; the adhesive layer includes the following raw materials in parts by weight: 36 parts of resin, 1 part of curing agent, 3 parts of thermal expansion material and 32 parts of solvent;

[0038] The resin is an acrylate resin, and the raw materials for the preparation of the acrylic resin include acrylate monomers and dicarboxylic acids; the molar ratio of acrylate monomers to dicarboxylic acids is 1:0.55;

[0039] The acrylate monomers are 2,3-dihydroxypropyl acrylate and butyl acrylate, and the molar ratio of 2,3-dihydroxypropyl acrylate to butyl acrylate is 1:3.2;

[0040] The dicarboxylic acid substance is 1,4-butanedioic acid;

[0041] The curing agent is 2,4-toluene diisocyanate;

[0042] Solvent is ethyl acetate;

[0043] Expancel series of expanded microspheres are used as thermal expansion materials;

[...

Embodiment 2

[0051] Embodiment 2 of the present invention provides a novel protective film containing a heat-reducing adhesive, including a substrate layer and an adhesive layer; the adhesive layer includes the following raw materials in parts by weight: 52 parts of resin, 4.8 parts of curing agent, 10 parts of thermal expansion material and 49 parts of solvent;

[0052] The resin is an acrylate resin, and the raw materials for the preparation of the acrylic resin include acrylate monomers and dicarboxylic acids; the molar ratio of acrylate monomers to dicarboxylic acids is 1:0.8;

[0053] The acrylate monomers are 2,3-dihydroxypropyl acrylate and butyl acrylate, and the molar ratio of 2,3-dihydroxypropyl acrylate to butyl acrylate is 1:4.8;

[0054] The dicarboxylic acid substance is 1,4-butanedioic acid;

[0055] The curing agent is 2,4-toluene diisocyanate;

[0056] Solvent is ethyl acetate;

[0057] Expancel series of expanded microspheres are used as thermal expansion materials;

...

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Abstract

The present invention relates to the technical field of protective films, and more particularly, the present invention provides a novel protective film containing thermal viscosity reducing adhesive and a preparation method thereof. The first aspect of the present invention provides a new type of protective film containing thermal viscosity reducing adhesive, comprising a substrate layer and an adhesive layer; wherein the adhesive layer includes raw materials: resin, curing agent, thermal expansion material and solvent; the resin is selected from polyurethane resin, acrylic acid Any one or a combination of resins and epoxy resins. The invention adopts a viscosity-reducing protective film containing a specific adhesive layer, and through the joint action of the acrylic resin in the adhesive layer and the thermal expansion material, the obtained protective film can achieve higher peeling strength before heat treatment, realize high adhesion, and can also be used in non-ferrous metals. It can be peeled off without residue at high temperature, which is very convenient in actual use.

Description

technical field [0001] The present invention relates to the technical field of protective films, and more specifically, the present invention provides a novel protective film containing heat-relieving adhesive and a preparation method thereof. Background technique [0002] When processing small components such as plastic parts, glass, metal plates, etc., it is usually necessary to use adhesive tape to assist in fixing to avoid damage caused by component movement during the cutting process. In addition, in etching, rinsing, or coating processes, when it is necessary to polish a part of the surface of a component, in order to protect other parts that do not need to be processed from being affected, tapes are also used to first cover the parts that do not need to be processed, and the parts to be processed Peel off when done. However, the adhesive strength of the tape used for fixing or covering needs to be strictly controlled. If the adhesive force is too strong, it is easy t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/35C09J7/25C09J175/04C09D133/08C09J11/08
CPCC09J7/35C09J7/255C09J175/04C09D133/066C09J11/08C09J2433/00C09J2467/006C09J2475/00
Inventor 柯跃虎诸葛锋曾庆明
Owner 广东硕成科技股份有限公司