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Photoelectric module assembly with constant temperature control function and manufacturing method thereof

A photoelectric module and constant temperature control technology, applied in the direction of electrical components, electric solid-state devices, laser components, etc., can solve problems such as large volume, poor process quality consistency, insensitive temperature control, etc., and achieve high-sensitivity temperature control and accurate solution The effect of control

Active Publication Date: 2021-07-20
广东鸿芯科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a photoelectric module assembly with constant temperature control function, which combines light emitting assembly (abbreviated as LD assembly), light receiving assembly (abbreviated as PD assembly), related integrated circuit chips, related electronic components, negative temperature coefficient The thermistor (referred to as NTC thin film resistor) and semiconductor thermoelectric cooler (referred to as TEC thermoelectric cooler) are organically integrated in one body, in addition to solving the problems of large volume, poor process quality consistency and inconsistent temperature control caused by discrete assembly technology. Sensitive, so that the photoelectric performance parameters of semiconductor lasers cannot be precisely controlled

Method used

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  • Photoelectric module assembly with constant temperature control function and manufacturing method thereof
  • Photoelectric module assembly with constant temperature control function and manufacturing method thereof
  • Photoelectric module assembly with constant temperature control function and manufacturing method thereof

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Embodiment

[0056] 1. A photoelectric module assembly with a constant temperature control function, the integrated TEC p-type semiconductor (201) adopts a p-type bismuth telluride semiconductor material, and the p-type bismuth telluride semiconductor material is Bi 2 Te 3 -Sb 2 Te 3 , the thickness of the integrated TEC p-type semiconductor (201) is 0.2mm-0.6mm.

[0057] The integrated TEC n-type semiconductor (202) adopts n-type bismuth telluride semiconductor material, and the n-type bismuth telluride semiconductor material is Bi 2 Te 3 -Bi 2 Se 3 , the thickness of the integrated TEC n-type semiconductor (202) is 0.2mm-0.6mm.

[0058] 2. A photoelectric module assembly with constant temperature control function, the material of the integrated TEC top metal electrode (203) and the integrated TEC bottom metal electrode (204) is a nickel-chromium-copper-nickel-chromium-gold composite conductor.

[0059] 3. A photoelectric module assembly with constant temperature control function, ...

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Abstract

A photoelectric module component with constant temperature control function and its manufacturing method, comprising: ceramic or glass substrate, light emitting component, light receiving component, integrated circuit chip, chip components, NTC thin film resistor, photoelectric module component top layer metal electrode , Integrated TEC thermoelectric cooler. Using the ceramic or glass substrate as a carrier, the light emitting component, the light receiving component, the integrated circuit chip, the chip components, the NTC are placed on the front of the ceramic or glass substrate Thin-film resistors are integrated; the integrated TEC thermoelectric cooler is organically integrated on the back of the ceramic or glass substrate to achieve precise temperature control, so as to solve the precise control of photoelectric performance parameters of photoelectric module components. Widely used in environmental atmosphere detection, communications, aerospace, aviation, ships, precision instruments, geological exploration, oil exploration, other field operations, industrial control and other fields, it has broad market prospects.

Description

technical field [0001] The invention relates to a photoelectric module assembly, in particular to a photoelectric module assembly with a constant temperature control function and a manufacturing method thereof. Background technique [0002] The original photoelectric module components with constant temperature control function are separated light emitting components (referred to as LD components), light receiving components (referred to as PD components), related integrated circuit chips, related electronic components, and negative temperature coefficient thermistors ( Referred to as NTC thin film resistors), separated semiconductor thermoelectric coolers (referred to as TEC thermoelectric coolers), etc., adopt traditional assembly technologies such as mounting and bonding, and are sealed in the shell in a clean environment, such as figure 1 shown. Due to the use of discrete assembly technology in the original technology, the volume is large, the assembly procedure is compl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/16H01L35/10H01L35/16H01S5/024H01S5/026
CPCH01S5/0261H01S5/0262H01S5/02415H01L25/167H10N10/82H10N10/852
Inventor 毛虎汪国平毛森王彦孚焦英豪陆凯凯
Owner 广东鸿芯科技有限公司
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