Photoelectric module assembly with constant temperature control function and manufacturing method thereof

Abstract

The invention discloses a photoelectric module assembly with a constant temperature control function and a manufacturing method thereof. The photoelectric module assembly comprises a ceramic or glasssubstrate, a light emitting assembly, a light receiving assembly, an integrated circuit chip, a chip component, an NTC thin film resistor, a top metal electrode of the photoelectric module assembly and an integrated TEC thermoelectric cooler. The ceramic or glass substrate is used as a carrier, and the light emitting assembly, the light receiving assembly, the integrated circuit chip, the chip component, the NTC thin-film resistor and the like are integrated into a whole on the front surface of the ceramic or glass substrate. The integrated TEC thermoelectric cooler is organically integrated on the back surface of the ceramic or glass substrate, so that the temperature is accurately controlled, and the photoelectric performance parameters of the photoelectric module assembly are accuratelycontrolled. The photoelectric module assembly is widely applied to the fields of environmental atmosphere detection, communication, aerospace, aviation, ships, precise instruments, geological exploration, oil exploration, other field operations, industrial control and the like, and has a wide market prospect.

Description

Technical field [0001] The present invention relates to a photoelectric module assembly, in particular, to a photoelectric module assembly with a constant temperature control function and a manufacturing method thereof. Background technique [0002] The original photoelectric module components with constant temperature control function are separated light emitting components (LD components for short), light receiving components (PD components for short), related integrated circuit chips, related electronic components, and negative temperature coefficient thermistors ( NTC thin film resistors for short), separate semiconductor thermoelectric coolers (TEC thermoelectric coolers for short), etc., adopt traditional assembly techniques such as mounting and bonding, and are sealed in a shell in a clean environment, such as figure 1 Shown. Due to the discrete assembly technology used in the original technology, it is difficult to ensure large volume, complex assembly procedures, low yie...

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a photoelectric module assembly with constant temperature control function, which combines light emitting assembly (abbreviated as LD assembly), light receiving assembly (abbreviated as PD assembly), related integrated circuit chips, related electronic components, negative temperature coefficient The thermistor (referred to as NTC thin film resistor) and semiconductor thermoelectric cooler (referred to as TEC thermoelectric cooler) are organically integrated in one body, in addition to solving the problems of large volume, poor process quality consistency and inconsistent temperature control caused by discrete assembly technology. Sensitive, so that the photoelectric performance parameters of semiconductor lasers cannot be precisely controlled

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