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Intermetallic compound polishing solution and intermetallic compound contour line display method

An intermetallic compound and display method technology, which is applied in the preparation of polishing compositions containing abrasives and test samples, can solve the problems of insufficient corrosion, poor display effect, and low display efficiency of the etchant configuration process, and achieve Guaranteed display effect and improved display efficiency

Active Publication Date: 2020-07-10
SHENZHEN KAIFA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] All in all, the current method of displaying intermetallic compounds has the following disadvantages: in the actual operation process, it is very easy to cause poor display effect due to insufficient or excessive corrosion, and the cumbersome etchant configuration process leads to low display efficiency

Method used

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  • Intermetallic compound polishing solution and intermetallic compound contour line display method
  • Intermetallic compound polishing solution and intermetallic compound contour line display method
  • Intermetallic compound polishing solution and intermetallic compound contour line display method

Examples

Experimental program
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Effect test

Embodiment 1

[0042]The preparation process of the intermetallic compound polishing solution of this embodiment is: first measure 116ml of deionized water and pour it into a cleaned container; then measure 1ml of hydrochloric acid with a mass fraction of 65% and pour it into a container filled with deionized water , fully stirred and cooled to room temperature; weighed 30g of alumina particles with a particle size of 0.05μm and poured them into the container, and stirred them sufficiently to make the alumina particles evenly distributed; measured 4.5ml of hydrogen peroxide and poured them into the container. Stir evenly to obtain an intermetallic compound polishing solution. Bottle the intermetallic compound polishing liquid prepared above for use. Since hydrogen peroxide is easy to decompose, the above intermetallic compound polishing liquid should not be stored for too long.

[0043] The method for displaying the contour line of the intermetallic compound sample in this embodiment include...

Embodiment 2

[0051] The method for displaying the outline of the intermetallic compound sample provided in this example is basically the same as that in Example 1. The difference is that the intermetallic compound sample in this example is a ball array packaged integrated circuit device of a certain electronic product. The lead-free solder joints are cut into cylinders of suitable size and obtained. Apparently, the intermetallic compound in this embodiment is a nickel-tin intermetallic compound.

[0052] After the intermetallic compound sample in this embodiment is profiled and displayed, it is observed with a metallographic microscope, and the results are as follows figure 2 shown. figure 2 We can clearly see the outline of the nickel-tin intermetallic compound in the intermetallic compound sample of this embodiment.

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Abstract

The invention discloses an intermetallic compound polishing solution and an intermetallic compound contour line display method. The intermetallic compound polishing solution is prepared from the following raw materials: hydrochloric acid, hydrogen peroxide, aluminum oxide particles and deionized water. The intermetallic compound contour line display method comprises the following steps: S1, cutting an intermetallic compound to obtain an intermetallic compound sample; S2, carrying out resin inlaying on the intermetallic compound sample; S3, carrying out mechanical grinding on the intermetalliccompound sample; S4, polishing the intermetallic compound sample for the first time by using a conventional aluminum oxide polishing solution; and S5, polishing the intermetallic compound sample for the second time by using the intermetallic compound polishing solution in any one of claims 1-5. By adopting the intermetallic compound contour line display method provided by the invention, the contour line of an intermetallic compound formed by soldering can be clearly displayed with high efficiency and high quality.

Description

technical field [0001] The invention relates to the technical field of intermetallic compound surface treatment, and more specifically, to an intermetallic compound polishing solution and an intermetallic compound contour line display method. Background technique [0002] Soldering is a type of connection method that uses welding materials with a melting point of no more than 400 ° C to achieve a connection by heating to a soldering temperature lower than the melting point of the welding base material but higher than the melting point of the welding material. The action spreads on the closely fitting joint surface, or spreads on the surface of the workpiece by wetting. During the soldering process, the thickness of the intermetallic compound formed in the interface area of ​​the brazing joint between the welding base metal and the welding material is a key factor affecting the reliability of the soldering joint. That is to say, in order to judge the reliability of brazed jo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09G1/02G01N1/32
CPCC09G1/02G01N1/32
Inventor 唐文亮任轩冉红锋张俭
Owner SHENZHEN KAIFA TECH