Heat dissipation type conductive double-sided adhesive tape and production process thereof

Abstract

The invention relates to the technical field of conductive double-sided adhesive tapes, in particular to a heat dissipation type conductive double-sided adhesive tape and a production process thereof.The heat dissipation type conductive double-sided adhesive tape comprises a bearing layer, a colloid layer and a release layer which are sequentially arranged from bottom to top, wherein the colloidlayer comprises a conductive adhesive layer and a heat dissipation adhesive layer group, the heat dissipation adhesive layer group comprises an upper adhesive layer, a graphite flake and a lower adhesive layer which are sequentially bonded from top to bottom, the thickness of the conductive adhesive layer is the same as the total thickness of the heat dissipation adhesive layer group, a heat conduction gap is formed between the conductive adhesive layer and the heat dissipation adhesive layer group at intervals, and the width of the heat conduction gap is 0.5-0.8mm; the conductive adhesive layer is used for matching with a copper exposure area of a flexible printed circuit board; the upper adhesive layer and the lower adhesive layer are matched with the graphite flake in shape, side edgesof the upper adhesive layer and the lower adhesive layer protrude out of the outer contour of the graphite flake, and the upper adhesive layer and the lower adhesive layer are mutually bonded to forma coating adhesive for coating the graphite flake. The heat dissipation type conductive double-sided adhesive tape is high in overall heat dissipation efficiency.

Description

technical field [0001] The invention relates to the technical field of conductive double-sided adhesive tape, in particular to a heat-dissipating conductive double-sided adhesive tape and a production process thereof. Background technique [0002] The flexible circuit board is usually bonded to a predetermined position of the electronic product by using conductive double-sided adhesive, which is used to realize relative fixation and circuit conduction between the flexible circuit board and the electronic product at the same time. [0003] After the circuit conduction between the flexible circuit board and the electronic product is realized, heat will inevitably be generated due to the existence of resistance. It will cooperate with the heat-dissipating double-sided adhesive tape to improve the stability of the connection between the flexible circuit board and the electronic product, and at the same time improve the heat dissipation efficiency of the joint between the flexibl...

AI Technical Summary

Problems solved by technology

[0005] The heat-dissipating conductive double-sided adhesive in the prior art is usually simply placed together with the conductive double-sided adhesive and the heat-dissipating double-sided adhesive. In actual use, due to the excellent thermal conductivity of the graphite sheet, the flexible circuit board and electronic products pass through the heat-dissipating adhesive. The heat at the joints of the layers can be dissipated better, but the heat dissipation efficiency is still low at the joints of the conductive double-sided adhesive

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