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Heat dissipation type conductive double-sided adhesive tape and production process thereof

A conductive double-sided adhesive and heat-dissipating technology, which is applied in the direction of conductive adhesives, adhesives, film/sheet adhesives, etc., can solve the problem of low heat dissipation at the joint of conductive double-sided adhesive, and achieve good Thermal conductivity and heat dissipation efficiency, improve heat dissipation efficiency, and increase the effect of temperature difference

Active Publication Date: 2020-07-10
东莞市星勤胶粘制品有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The heat-dissipating conductive double-sided adhesive in the prior art is usually simply placed together with the conductive double-sided adhesive and the heat-dissipating double-sided adhesive. In actual use, due to the excellent thermal conductivity of the graphite sheet, the flexible circuit board and electronic products pass through the heat-dissipating adhesive. The heat at the joints of the layers can be dissipated better, but the heat dissipation efficiency is still low at the joints of the conductive double-sided adhesive

Method used

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  • Heat dissipation type conductive double-sided adhesive tape and production process thereof
  • Heat dissipation type conductive double-sided adhesive tape and production process thereof
  • Heat dissipation type conductive double-sided adhesive tape and production process thereof

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Embodiment Construction

[0043] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0044] refer to figure 1 , is a kind of heat-dissipating conductive double-sided adhesive disclosed by the present invention, comprising a carrier layer 1, a colloid layer 2 and a release layer 22 arranged in sequence from bottom to top, wherein the carrier layer 1 is a transparent silicone protective film, and the colloid layer 2 is located above the bearing layer 1, and the colloidal layer 2 and the release layer 22 form a colloidal unit 21, the number of colloidal units 21 is multiple, and the plurality of colloidal units 21 are arranged at intervals along the length direction of the bearing layer 1 on the bearing layer 1 , and the bearing layer 1 can finally be rolled into a roll that occupies a small space and is easy to transport.

[0045] refer to figure 2 and image 3 , the colloid layer 2 includes a conductive adhesive layer and a heat dissipatio...

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Abstract

The invention relates to the technical field of conductive double-sided adhesive tapes, in particular to a heat dissipation type conductive double-sided adhesive tape and a production process thereof.The heat dissipation type conductive double-sided adhesive tape comprises a bearing layer, a colloid layer and a release layer which are sequentially arranged from bottom to top, wherein the colloidlayer comprises a conductive adhesive layer and a heat dissipation adhesive layer group, the heat dissipation adhesive layer group comprises an upper adhesive layer, a graphite flake and a lower adhesive layer which are sequentially bonded from top to bottom, the thickness of the conductive adhesive layer is the same as the total thickness of the heat dissipation adhesive layer group, a heat conduction gap is formed between the conductive adhesive layer and the heat dissipation adhesive layer group at intervals, and the width of the heat conduction gap is 0.5-0.8mm; the conductive adhesive layer is used for matching with a copper exposure area of a flexible printed circuit board; the upper adhesive layer and the lower adhesive layer are matched with the graphite flake in shape, side edgesof the upper adhesive layer and the lower adhesive layer protrude out of the outer contour of the graphite flake, and the upper adhesive layer and the lower adhesive layer are mutually bonded to forma coating adhesive for coating the graphite flake. The heat dissipation type conductive double-sided adhesive tape is high in overall heat dissipation efficiency.

Description

technical field [0001] The invention relates to the technical field of conductive double-sided adhesive tape, in particular to a heat-dissipating conductive double-sided adhesive tape and a production process thereof. Background technique [0002] The flexible circuit board is usually bonded to a predetermined position of the electronic product by using conductive double-sided adhesive, which is used to realize relative fixation and circuit conduction between the flexible circuit board and the electronic product at the same time. [0003] After the circuit conduction between the flexible circuit board and the electronic product is realized, heat will inevitably be generated due to the existence of resistance. It will cooperate with the heat-dissipating double-sided adhesive tape to improve the stability of the connection between the flexible circuit board and the electronic product, and at the same time improve the heat dissipation efficiency of the joint between the flexibl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/21C09J7/20C09J9/02
CPCC09J9/02C09J2400/10C09J2400/263C09J7/20C09J7/21
Inventor 陈康陈健万均成
Owner 东莞市星勤胶粘制品有限公司
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