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Methyl organic silicon adhesive with excellent flexibility and strong adhesion for LED

An adhesive and flexible technology, applied in the direction of adhesive additives, polymer adhesive additives, non-polymer adhesive additives, etc., can solve the problem of large contact area between large-sized chips and substrates, chip and substrate peeling, Colloid cracking and other problems, to achieve long-term stable storage, increase flexibility, and promote the effect of complete addition reaction

Active Publication Date: 2020-07-14
南京科矽新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the field of large-size chip packaging, due to the large contact area between the large-size chip and the substrate and the large internal stress, it is easy to crack the colloid during the reflow process of the package, causing the chip and the substrate to peel off, resulting in dead lights

Method used

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  • Methyl organic silicon adhesive with excellent flexibility and strong adhesion for LED
  • Methyl organic silicon adhesive with excellent flexibility and strong adhesion for LED

Examples

Experimental program
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Effect test

Embodiment 1

[0037] This implementation proposes a method for preparing a methyl silicone adhesive for LEDs with excellent flexibility and strong adhesion, including the following steps:

[0038] Weigh 60 parts of raw material MQ type silicone resin (molecular weight is about 11000, viscosity is about 25000mPa.s, vinyl weight fraction 4.0%) and MDQ type silicone resin 15 parts (molecular weight is about 3000, viscosity is about 7000mPa.s, vinyl weight fraction 4.0%), mix uniformly; Weigh 16 parts of crosslinking agent A (viscosity is 30mPa.s, molecular weight is 500, hydrogen mass fraction is 0.4%), crosslinking agent B 4 parts (viscosity is 60mPa.s, molecular weight 2500, hydrogen mass fraction 1.4%), mix uniformly; mix the mixture of main resin and crosslinking agent at 60°C, cool to room temperature; then add 3 parts of tackifier, inhibitor 0.4 parts of A, 0.4 parts of inhibitor B, and mix evenly again; then add 0.3 parts of catalyst and 5 parts of fillers and mix evenly; finally, after...

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Abstract

The invention discloses a methyl organic silicon adhesive with excellent flexibility and strong adhesion for an LED. The formula comprises the following raw materials in parts by weight; 40-80 parts of MQ type methyl vinyl silicone resin, 10-20 parts of MDQ type methyl vinyl silicone resin, 10-20 parts of a cross-linking agent A, 2-7 parts of a cross-linking agent B, 3-7 parts of a specially-madefiller, 1-5 parts of a tackifier, 0.2-0.5 part of a catalyst, 0.3-0.6 part of an inhibitor A and 0.3-0.6 part of an inhibitor B. According to the organic silicon adhesive prepared by the invention, acured main body structure does not contain phenyl and has relatively high flexibility, and meanwhile, through optimal design of molecular structures of the main body resin and the cross-linking agent,the high-temperature stability and the adhesive property of the organic silicon adhesive are effectively improved, and the organic silicon adhesive is particularly suitable for die bonding of large-size chips.

Description

technical field [0001] The invention relates to a methyl silicone adhesive for LEDs with excellent flexibility and strong adhesion, and belongs to the technical field of semiconductor light-emitting chip packaging application materials. Background technique [0002] With the development of industrial technology, energy and environmental issues have become a common topic all over the world. Due to the excellent performance of LED light sources in terms of energy saving and environmental protection, they have been widely used in many fields such as lighting, display, backlight and decoration. The fourth generation of lighting sources after lamps. Various countries and regions have also launched semiconductor lighting plans to promote the development of the LED industry, such as the "National Semiconductor Lighting Research Program" in the United States, the "Solid State Lighting Research Project" in the European Union, and the "GaN Semiconductor Development Program" in South K...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/08C09J11/06C09J11/04H01L33/48
CPCC09J183/04C09J11/08C09J11/06C09J11/04H01L33/48H01L2933/0033C08L2205/035C08L2205/025C08L2203/206C08K2201/006C08L83/04C08K9/06C08K7/26C08K5/11C08K5/521
Inventor 谈高马飞孙璇
Owner 南京科矽新材料科技有限公司
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