Chip heat exchanger and variable frequency air conditioner

Abstract

The invention discloses a chip heat exchanger and a variable frequency air conditioner, and belongs to the field of chip heat dissipation. The chip heat exchanger comprises a heat pipe, a capillary pipe, an outdoor heat exchanger, an indoor heat exchanger and a compressor; and an evaporation section of the heat pipe is arranged below a chip of a computer board of the air conditioner, a branch pipeof the capillary pipe is wound around a condensation section of the heat pipe, a first end of a main pipe of the capillary pipe is connected with the indoor heat exchanger, a second end of the main pipe of the capillary pipe is connected with the outdoor heat exchanger, and the indoor heat exchanger and the outdoor heat exchanger are connected with the compressor. According to the scheme, the branch pipe of the capillary pipe absorbs heat dissipated by the heat pipe, the temperature of the chip is reduced, cooperative debugging of system working conditions is easier due to crotch-shaped branches instead of parallel channels, and the problems of user complaints caused by low and difficult refrigeration frequency rise, easiness in error reporting of control logics, insufficient refrigeration capacity, high operation power consumption and the like due to poor heat dissipation of the chip of the computer board of the variable frequency air conditioner in a high-temperature environment insummer are solved.

Description

technical field [0001] The invention relates to the technical field of chip heat dissipation, in particular to a chip heat exchanger and a frequency converter air conditioner. Background technique [0002] At present, under the high temperature environment in summer, the chip of the inverter air conditioner computer board has poor heat dissipation, which leads to slow and difficult cooling frequency increase, error-prone control logic, insufficient cooling capacity, and high power consumption during operation, causing complaints from users. T3 working condition (53°C) or higher ambient temperature, air temperature around the inverter chip +10°C (63°C), difference between the heat source temperature of the computer board (68-120°C) and the ambient temperature (5-57°C) When the temperature becomes smaller, the heat dissipation power becomes smaller, and even computer boards are burned, the system goes down, and hardware failures occur. Contents of the invention [0003] The...

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Problems solved by technology

[0002] At present, under the high temperature environment in summer, the chip of the computer board of the inverter air conditioner has poor heat dissipation, which leads to slow and difficult frequency increase of cooling, easy error reporting of control logic, insufficient cooling capacity, and high power consumption during operation, causing complaints from users

T3 working condition (53°C) or higher ambient temperature, air temperature around the inverter chip +10°C (63°C), difference between the heat source temperature of the computer board (68-120°C) and the ambient temperature (5-57°C) become smaller, the heat dissipation power becomes smaller, and even the computer board is burned, the system is down, and the hardware failure is caused.

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