Semiconductor process equipment and cooling device thereof

A technology of cooling device and process equipment, which is applied in semiconductor/solid-state device manufacturing, metal material coating process, vacuum evaporation plating, etc., which can solve the problems of low cooling efficiency and reduced production capacity, so as to improve cooling efficiency and yield , Improve the effect of cooling efficiency

Active Publication Date: 2020-07-31
北京七星华创集成电路装备有限公司
View PDF6 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the shortcomings of the existing methods, this application proposes a semiconductor process equipment and its cooling device to solve the technical problem of low cooling efficiency in the prior art that leads to reduced production capacity

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor process equipment and cooling device thereof
  • Semiconductor process equipment and cooling device thereof
  • Semiconductor process equipment and cooling device thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] The present application will be described in detail below. Examples of embodiments of the present application are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar components or components with the same or similar functions. In addition, if a detailed description of the known technology is unnecessary for the illustrated features of the present application, it will be omitted. The embodiments described below with reference to the accompanying drawings are exemplary, and are only used to explain the present application, and cannot be construed as a limitation to the present application.

[0025] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms such as those define...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides semiconductor process equipment and a cooling device thereof. The cooling device is arranged on a process chamber of the semiconductor process equipment, is used for cooling a tray in the process chamber and a to-be-processed workpiece borne on the tray, and comprises an air blowing mechanism, a flow uniformizing mechanism and a cooling mechanism; the air blowing mechanism is arranged on an upper cover of the process chamber; an air outlet of the air blowing mechanism faces the middle of the process chamber, and an air return port of the air blowing mechanism deviates from the middle of the process chamber; the flow uniformizing mechanism is arranged below the air blowing mechanism and comprises a flow uniformizing cavity connected with the air outlet; the cooling mechanism is arranged in the flow uniformizing cavity; airflow generated by the air blowing mechanism enters the flow uniformizing cavity through the air outlet and exchanges heat with the tray and theworkpiece to be processed after being cooled by the cooling mechanism, and the airflow subjected to heat exchange enters the air blowing mechanism through the air return port. According to the embodiment of the invention, the cooling efficiency of the to-be-processed workpiece is greatly improved, so that the production efficiency of coating is effectively improved, and the production takt is accelerated.

Description

Technical field [0001] This application relates to the technical field of semiconductor processing. Specifically, the application relates to a semiconductor processing equipment and a cooling device thereof. Background technique [0002] At present, with the rapid development of science and technology, magnetron sputtering coating technology has gradually been widely used in various fields of industry and has become the main method of a new generation of environmentally friendly coating technology. [0003] In the prior art, the substrate generates a certain amount of heat during the magnetron sputtering coating process. As the continuous coating process continues, the heat generated during the film deposition process causes the temperature in the process chamber to continue to rise. It will also increase the temperature of the substrate and eventually reach a certain peak. In the process of magnetron sputtering terbium film plating on neodymium iron boron substrates, if the sampl...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/32H01L21/67C23C14/35C23C14/54
CPCH01J37/32724H01L21/67109C23C14/541C23C14/35H01J2237/3322
Inventor 李建银金晨
Owner 北京七星华创集成电路装备有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap