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Optical switch curable polyisobutylene adhesive composition and its sizing process

A technology of polyisobutylene and composition, applied in the direction of adhesives, polymer adhesive additives, non-polymer adhesive additives, etc., can solve problems such as bonding and sealing of opaque materials, limiting application range, etc., and achieve curing The effect of faster speed, slower production line speed, and reduced irradiation dose

Active Publication Date: 2021-07-20
郝建强 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its defects are also obvious. It is only suitable for surface coating and bonding and sealing of transparent materials, and cannot be used for bonding and sealing of opaque materials. Most electronic products are composed of opaque materials, thus limiting Its scope of application

Method used

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  • Optical switch curable polyisobutylene adhesive composition and its sizing process
  • Optical switch curable polyisobutylene adhesive composition and its sizing process
  • Optical switch curable polyisobutylene adhesive composition and its sizing process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment -1

[0034] [Example-1] 100 parts by weight of EPION 203A resin and 6 parts by weight of 0.75% hydrogen-containing silicone oil, diethyl maleate 30×10 -6 parts by weight, put into a planetary mixer and carry out vacuum stirring for 1h, then add platinum acetylacetonate 6.0×10 -6 parts by weight, and vacuum stirred for 30 minutes to obtain a transparent viscous adhesive composition, which is filled into a silica gel cartridge (cartridge) for storage.

[0035] Preparation of dumbbell plates:

[0036] Extrude the above-mentioned adhesive composition from the silica gel cylinder to make a 100*100*2mm test piece, and the irradiation dose of the high-pressure mercury lamp is 500mJ / cm 2 , and then thermally cured at 80°C for 1min, and then tested the moisture permeability of the test piece after standing at room temperature for 24h.

[0037] Test of gel time at 80°C:

[0038] Extrude the above-mentioned adhesive composition from the silicone cylinder, and irradiate it with a high-press...

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PUM

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Abstract

The invention discloses an optical switch curing type polyisobutylene adhesive composition and a sizing process thereof. In parts by weight, the composition comprises 100 parts of vinyl silicon-terminated polyisobutylene polymer, 0.1 to 20 parts of hydrogen-containing silicone oil, 2.0 to 20×10 ‑6 Parts of light switch type UV photoinitiator, 20~200×10 ‑6 The sizing process is: after dispensing glue on the flange to be sealed, follow the dispensing head with a UV point light source, assemble immediately after sizing and irradiating, and then place it at room temperature to cure, or 80 degrees for 1min Heating curing can solve the problem that single-component hydrosilylation reaction requires high temperature and long time to cure. It is a new type of FIPG adhesive with excellent gas barrier properties, which can be used for sealing applications that require extremely high hydrogen barrier properties. Such as the gas seal of the hydrogen fuel cell bipolar plate, etc.

Description

technical field [0001] The invention belongs to the field of adhesive preparation, and in particular relates to an optical switch curable polyisobutylene adhesive composition and a sizing process thereof. Background technique [0002] Electronic products often use one-component low-temperature fast-curing epoxy resin in the assembly process. Since some electronic components are not heat-resistant, the curing temperature cannot exceed 80°C. At the same time, due to the large production capacity of the assembly line, products of several K to tens of K are often produced every day, and the curing speed of the epoxy adhesive is required to be very fast to meet the production capacity requirements. It is best to cure within 1 minute at 80°C. The fastest is the thiol epoxy system, that is, epoxy resin + trifunctional or tetrafunctional thiol + latent curing agent + inhibitor, which can only be cured at 80°C for 2 to 5 minutes. If the curing speed is further increased, its preserv...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J123/26C09J183/05C09J11/06C09J11/08C09J11/04B05D3/02B05D3/04B05D3/06B05D7/26
CPCB05D3/0254B05D3/0406B05D3/067B05D7/26C08K2201/014C08L2201/14C08L2205/03C09J11/04C09J11/06C09J11/08C09J123/26C08L83/04C08K5/11C08K13/04C08K7/26C08K5/1345C08K5/5425
Inventor 郝建强
Owner 郝建强