TOPCON passivation structure and preparation method thereof
An N-type, device technology, applied in the field of passivation structure and its preparation, can solve the problems of poor passivation effect and affecting the passivation quality of silicon substrate doped layer, etc.
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[0024] In order to make the technical means, creative features, objectives and effects of the present invention easy to understand, the present invention will be further explained in conjunction with specific drawings.
[0025] according to figure 1 As shown, the TOPCON passivation structure provided by the present invention includes an N-type or P-type silicon wafer substrate 100. The front surface of the silicon wafer substrate 100 is a suede surface, and the back surface is a polished or suede surface; the surface of the silicon wafer substrate 100 is composed of A tunneling silicon dioxide layer 101, a doped polysilicon layer / amorphous silicon layer 102 with a TOPCon structure, a passivation layer 103, and a SiNx cap layer 104 are sequentially arranged from the inside to the outside; the thickness of the tunneling silicon dioxide layer 101 is 0 The thickness of the doped polysilicon layer or amorphous silicon layer 102 of the TOPCon structure is 5-5000 nm, the thickness of th...
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