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Thermal insulation board and preparation method thereof

A heat insulation and panel layer technology, applied in chemical instruments and methods, other household appliances, household components, etc., can solve the problems of airgel powder dropping, poor flexibility, airgel brittleness, etc., and achieve excellent impact resistance Compressive properties, expanding the scope of application, and improving the effect of mechanical properties

Inactive Publication Date: 2020-08-11
GONG YI VAN-RES INNOVATION COMPOSITE MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Insulation mortar has the following disadvantages: high density, the weight of the insulation layer will easily bring difficulties to the construction, and increase the load-bearing burden of the building skeleton; high thermal conductivity, meet the national energy-saving standard, thick thickness; high hygroscopicity, easily lead to excessive weight, Falling off; Affected by construction factors, the strength changes greatly
However, due to the structural characteristics of airgel, airgel has disadvantages such as high brittleness and poor flexibility. At the same time, due to its preparation method, SiO 2 During the transportation, construction and use of airgel blankets, it is common for airgel powder to fall off from the felt body. The powder loss not only brings inconvenience to the construction, but also poses a threat to the health of the construction workers, and also reduces air condensation. The performance of the rubber felt itself greatly limits the application range of the airgel felt
Using airgel as the core material of the composite board can solve the problem of airgel powder dropping, but in view of the disadvantages of airgel's poor mechanical properties, it cannot meet the use requirements in some occasions that require high mechanical properties.

Method used

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  • Thermal insulation board and preparation method thereof
  • Thermal insulation board and preparation method thereof
  • Thermal insulation board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] like figure 1 , image 3 and Figure 4 As shown, a heat insulation board comprises a first panel layer 1, a second panel layer 2, a sandwich layer, and a skeleton support layer 4. The sandwich layer is an airgel felt layer, and the airgel felt The layer is formed by splicing several cuboid fiber-reinforced airgel composite mats 3; the sandwich layer is arranged between the first panel layer 1 and the second panel layer 2, and the lower surface of the sandwich layer and the first panel layer 1 between the upper surface of the sandwich layer and the second panel layer 2, the surrounding (front, back, left, and right) edges of the sandwich layer, and any two adjacent fiber-reinforced airgel composite felts 3 in the sandwich layer. The molding is filled with a skeleton support layer 4, and the skeleton support layer 4 is integrally cured with the first panel layer 1 and the second panel layer 2;

[0044] The first panel layer 1, the second panel layer 2 and the skeleton ...

Embodiment 2

[0054] A kind of thermal insulation board, structure such as figure 2 , image 3 and Figure 4 As shown, that is, the difference from Example 1 is that the sandwich layer is formed by superimposing two layers of airgel felt layers, and each layer of airgel felt layer is formed by splicing several cuboid fiber-reinforced airgel composite felts 3. The thickness of each airgel felt layer is 1 mm; correspondingly, in the step (1) of the preparation step, the fiber-reinforced airgel composite felt 3 wrapped in the third fiber cloth is spliced ​​together to form two spliced ​​layers , the two spliced ​​layers are aligned up and down and stacked to form a spliced ​​body; others are the same as in Embodiment 1.

[0055] The density of the thermal insulation board prepared in this embodiment is 0.33 g / cm 3 , the compressive strength is 4.0 Mpa.

Embodiment 3

[0057] A kind of thermal insulation board, structure such as figure 1 , image 3 and Figure 5 As shown, that is, the difference from Example 1 is: the implementation of the flow guide and the injection part is shown in Figure 5 , the injection part also includes a main injection tube 62, all branch injection tubes 61 are connected to the main injection tube 62, and the other end of the main injection tube 62 is used as the injection port 8; the preparation steps are the same as in Example 1.

[0058] The density of the thermal insulation board prepared in this embodiment is 0.28 g / cm 3 , the compressive strength is 3.8 Mpa.

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Abstract

The invention belongs to the technical field of thermal insulation materials, and discloses a thermal insulation board and a preparation method thereof. The thermal insulation board comprises a firstpanel layer, a second panel layer, a sandwich layer and framework supporting layers. The sandwich layer is an aerogel felt layer or is formed by stacking two or more aerogel felt layers, and each aerogel felt layer is formed by splicing a plurality of fiber-reinforced aerogel composite felts; the sandwich layer is arranged between the first panel layer and the second panel layer, the lower surfaceof the sandwich layer and the first panel layer, the upper surface of the sandwich layer and the second panel layer, the peripheral edge of the sandwich layer and a splicing seam of any two adjacentfiber reinforced aerogel composite felts in the sandwich layer are integrally formed and filled with the framework supporting layer. The preparation method comprises the following steps: laying, sealing, preparing a glue solution, injecting glue, curing and demolding to obtain the thermal insulation board. An integral curing molding method is adopted, the framework supporting layers are formed while the panel is obtained, and the prepared thermal insulation board has the advantages of light weight, thermal insulation and greatly improved mechanical properties.

Description

technical field [0001] The invention belongs to the technical field of thermal insulation materials, and in particular relates to a thermal insulation board and a preparation method thereof. Background technique [0002] At present, the development of new energy, the improvement of the utilization rate of existing energy and the conservation of energy have attracted great attention from all countries. my country is an energy-poor country, therefore, rational use of energy and energy conservation are of great significance to the sustainable development of our society. Adopting new technologies and processes to develop environmentally friendly heat insulation materials is one of the most effective and economical measures to save energy. [0003] The commonly used thermal insulation materials in construction are mostly thermal insulation mortar, which is a kind of ready-mixed mortar made of various lightweight materials as aggregates, cement as cementitious material, mixed wit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/36B32B27/06B32B27/12B32B3/08B32B3/14B32B27/26B32B27/18B32B27/04B32B7/12B32B33/00B29C70/36B29C70/54B29L31/30
CPCB29C70/36B29C70/54B29L2031/30B32B3/085B32B3/14B32B27/08B32B27/12B32B27/18B32B27/26B32B27/36B32B33/00B32B2250/40B32B2260/021B32B2260/046B32B2266/0235B32B2266/0285B32B2307/30B32B2307/304B32B2307/558
Inventor 姚栋嘉董会娜余启勇张继承刘光亚李帅帅陈帅杨红霞吴恒张东生
Owner GONG YI VAN-RES INNOVATION COMPOSITE MATERIAL CO LTD
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