Epoxy resin liquid mixture and its uv delayed curing solid film

A technology of epoxy resin and novolac epoxy resin, which is applied in the direction of epoxy resin glue, novolak epoxy resin adhesive, adhesive, etc., can solve the problem of no bonding reliability and good UV delay epoxy structural adhesive film and other problems, achieve high bonding reliability, realize bonding reliability, and facilitate die-cutting effects

Active Publication Date: 2021-11-02
SHUNDE POLYTECHNIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, there are liquid glues with UV delay in the industry. For example, the patent number is ZL201510006072.1, and the name is "UV-induced delayed curing one-component epoxy adhesive". The application number is 201780021968.4, and the name is "photocurable The invention patent application for the composition containing electronic olefins", the application number is 201680068589.6, the invention patent application and the patent number are "delayed curing photocurable resin composition" and the patent number is ZL201010225303.5, the name is "delayed curing resin composition" Composition" invention patent, they are all liquid glues with UV delayed curing. Compared with glue, the adhesive film has greater advantages in the bonding process, but there is no UV delayed epoxy structural adhesive with good bonding reliability in the industry Membrane reports cannot meet the needs of the above application scenarios

Method used

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  • Epoxy resin liquid mixture and its uv delayed curing solid film
  • Epoxy resin liquid mixture and its uv delayed curing solid film
  • Epoxy resin liquid mixture and its uv delayed curing solid film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] (1) Preparation of isocyanic acid modified cycloaliphatic epoxy resin:

[0032] The synthetic route of described isocyanic acid modified cycloaliphatic epoxy resin is shown in the following formula:

[0033]

[0034] Among them, R 1 for H, R 2 for -(CH 2 ) m -, x is 20, y is 5, n is 20, m is 1;

[0035] Add alicyclic epoxy acrylic monomers with double bonds and acrylic monomers with isocyanic acid into solvent B, add initiator A, react at a temperature of 40°C for 2 hours, then add a polymerization inhibitor, After purification, a solid isocyanate-modified cycloaliphatic epoxy resin can be obtained.

[0036] The alicyclic epoxy acrylic monomer with a double bond is 3,4-epoxycyclohexyl methacrylate; the acrylic monomer with isocyanate is isocyanoethyl methacrylate; The initiator A is benzoyl peroxide; the solvent B is cyclohexanone; and the polymerization inhibitor is 2,4,6-trinitrophenol (TNP).

[0037] (2) Preparation of epoxy resin liquid mixture:

[0038]M...

Embodiment 2

[0045] (1) Preparation of isocyanic acid modified cycloaliphatic epoxy resin:

[0046] The synthetic route of isocyanic acid modified cycloaliphatic epoxy resin is shown in the following formula:

[0047]

[0048] Among them, R 1 for CH 3 -, R 2 for - (CH 2 -O-CH 2 )m-, x is 100, y is 100, n is 200, m is 10;

[0049] Add alicyclic epoxy acrylic monomers with double bonds and acrylic monomers with isocyanic acid into solvent B, add initiator A, react at a temperature of 40°C for 2 hours, then add a polymerization inhibitor, Solid isocyanic acid modified cycloaliphatic epoxy resin can be obtained after purification;

[0050] The acrylic monomer of the alicyclic epoxy with double bond is 3,4-epoxycyclohexylmethyl methacrylate; the acrylic monomer with isocyanate is 2-(2-isocyanate Acid ethoxy) ethyl methacrylate; The initiator A is azobisisoheptanonitrile; The solvent B is dioxane, and the polymerization inhibitor is 1,4-benzoquinone (BQ) .

[0051] (2) Preparation of...

Embodiment 3

[0059] (1) Preparation of isocyanic acid modified cycloaliphatic epoxy resin:

[0060] The synthetic route of isocyanic acid modified cycloaliphatic epoxy resin is shown in the following formula:

[0061]

[0062] where R 1 for CH 3 -, R 2 for - (CH 2 -O-CH 2 ) m -, x is 50, y is 60, n is 100, m is 8;

[0063] Add alicyclic epoxy acrylic monomers with double bonds and acrylic monomers with isocyanic acid into solvent B, add initiator A, react at a temperature of 60°C for 4 hours, then add a polymerization inhibitor, Solid isocyanic acid modified cycloaliphatic epoxy resin can be obtained after purification;

[0064] The alicyclic epoxy acrylic monomer with a double bond is 3,4-epoxycyclohexylmethyl methacrylate; the acrylic monomer with isocyanate is isocyanoethyl acrylate; The initiator A is dimethyl azobisisobutyrate; the solvent B is chloroform; and the polymerization inhibitor is β-phenylnaphthylamine.

[0065] (2) Preparation of epoxy resin liquid mixture:

...

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Abstract

The invention relates to a liquid epoxy resin mixture and a UV delayed curing solid adhesive film prepared therefrom. Cyclic Epoxy Resin, UV Delayed Curing Agent, Toughener, Filler and Solvent A. The bonding and curing mechanism of the UV delayed curing solid adhesive film prepared from the epoxy resin liquid mixture is pre-activated by UV, and then bonded, and then the delayed curing mechanism and moisture post-curing mechanism in the UV delayed initiator are used. Achieve the final bond. The UV delayed curing solid adhesive film has the dual advantages of tape and glue and the characteristics of UV delayed curing. It is especially suitable for the bonding of small parts such as sensors. It does not require high temperature curing and has excellent bonding strength and long-term reliability.

Description

technical field [0001] The invention relates to an epoxy resin liquid mixture and a UV delayed curing solid adhesive film prepared therefrom. The UV delayed cured solid adhesive film is applied in the field of sensor bonding. Background technique [0002] With the development of science and technology, more and more smart chips or sensors need to be bonded and fixed, such as automobiles, mobile phones, wearables and other devices. The bonding and fixing of sensors requires strong bonding strength and reliability. At the same time, due to these The bonding of the sensor requires a lower temperature, so the bonding material is required to have the characteristics of low-temperature curing. Therefore, the current industry mainly uses room-temperature-curing two-component structural adhesives, low-temperature-curing thermosetting adhesives or anaerobic adhesives for bonding, but When liquid glue is used for bonding, due to the fluidity of the liquid, it is easy to cause the tilt...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J133/14C09J163/04C08G59/68C09J7/30C09J7/40
CPCC08G59/688C08L2205/03C09J163/00C09J2203/326C09J7/30C09J7/40C08L33/14C08L63/04
Inventor 刘锋陈燕舞吴嘉培高仕旭
Owner SHUNDE POLYTECHNIC
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