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Bump packaging structure and manufacturing method of bump package structure

A technology of packaging structure and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as product performance degradation and failure, and achieve improved bonding force, increased volume, and avoid hidden solder joints. The effect of cracking or even failure

Inactive Publication Date: 2020-08-14
FOREHOPE ELECTRONICS NINGBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The bump includes a copper pillar, a metal layer (UBM: under bumpmetalization) and a passivation layer (passivation). The copper pillar bump can have a minimum pitch, and the copper layer of the flip-chip substrate adopts a core-less coreless substrate and a coreless substrate. Its material is mostly FR4 resin or BT resin. Under the influence of external mechanics, time, temperature, humidity and other conditions, the matrix will undergo irreversible plastic deformation and the silicon chip material inside the package (the thermal expansion coefficient is 2.5 ppm / C ) and the base material (the thermal expansion coefficient is 12 ppm / C), the material, the stress caused by the thermal expansion coefficient mismatch acts on the chip bump (soldering point), and the stress causes the product performance to decline or even fail

Method used

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  • Bump packaging structure and manufacturing method of bump package structure
  • Bump packaging structure and manufacturing method of bump package structure
  • Bump packaging structure and manufacturing method of bump package structure

Examples

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no. 1 example

[0054] Please refer to figure 1, this embodiment provides a bump packaging structure 100, which can improve the overall structural strength and connection strength, and avoid the problem that the stress caused by the mismatch of the thermal expansion coefficient acts on the chip soldering point and causes the soldering point to crack or even fail. And can effectively protect the structure from water vapor, ion pollution, radiation or adverse environmental intrusion.

[0055] The bump packaging structure 100 provided in this embodiment includes a base 110, a first conductive bump 130 disposed on the base 110, a second conductive bump 150 disposed on the first conductive bump 130, and a second conductive bump 150 disposed on the second conductive bump. The solder ball 170 on the bump 150; wherein, the width L2 of the second conductive bump 150 is greater than the width L1 of the first conductive bump 130; a groove 151 is opened on the second conductive bump 150, and the solder b...

no. 2 example

[0072] see figure 2 , the present embodiment provides a method for manufacturing the bump packaging structure 100, which is used to manufacture the bump packaging structure 100 as provided in the first embodiment, the method includes:

[0073] S1: forming a first conductive bump 130 on the substrate 110 .

[0074] Specifically, a protective layer 190 is coated on the surface of the substrate 110, and a metal pad 191 is opened by a photolithography process, and then a metal layer 180 is formed by a sputtering process, and a capping layer 131 is coated on the metal layer 180, and formed by a photolithography process. The bump opening 133 , the copper layer is electroplated in the bump opening 133 to form the first conductive bump 130 .

[0075] Specifically, first take a substrate 110, coat the protective layer 190 (passivation) on the surface of the substrate 110, use a photolithography process (exposure / development / baking) to open the metal pad 191, and then use a sputtering...

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Abstract

The embodiment of the invention provides a bump packaging structure and a manufacturing method of the bump packaging structure, and relates to the technical field of semiconductor packaging. The bumppackaging structure comprises a substrate, a first conductive bump arranged on the substrate, a second conductive bump arranged on the first conductive bump and a solder ball arranged on the second conductive bump; the width L2 of the second conductive bump is greater than the width L1 of the first conductive bump; the second conductive bump is provided with a groove, and the solder ball covers the second conductive bump and partially fills the groove. T-shaped structures of the first conductive convex block and the second conductive convex block can greatly improve the structural strength ofa copper column convex block. Meanwhile, through the arrangement of the groove, the binding force between a solder and the second conductive bump is improved, and the solder can play a certain role inbuffering, so that the problems of subfissure and even failure of welding spots caused by stress action on the welding spots of the chip due to mismatching of thermal expansion coefficients can be avoided.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a bump packaging structure and a method for manufacturing the bump packaging structure. Background technique [0002] With the rapid development of the semiconductor industry, the flip-chip packaging structure is widely used in the semiconductor industry. The flip-chip packaging uses bumps to electrically connect the chip and the substrate. The bump includes a copper pillar, a metal layer (UBM: under bumpmetalization) and a passivation layer (passivation). The copper pillar bump can have a minimum pitch, and the copper layer of the flip-chip substrate adopts a core-less coreless substrate and a coreless substrate. Its material is mostly FR4 resin or BT resin. Under the influence of external mechanics, time, temperature, humidity and other conditions, the matrix will undergo irreversible plastic deformation and the silicon chip material inside the package (the ther...

Claims

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Application Information

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IPC IPC(8): H01L23/488H01L21/60
CPCH01L24/11H01L24/13H01L2224/13005H01L2224/1301H01L2224/1308
Inventor 何正鸿孙杰
Owner FOREHOPE ELECTRONICS NINGBO CO LTD