Ultralight/overweight non-silicon release film and preparation method thereof

A non-silicon release and release film technology, applied in the direction of film/sheet release liner, film/sheet adhesive, conductive coating, etc., can solve the silicon pollution of materials, silicon pollution of products, transfer to Protect the surface of the film glue and other problems, to achieve the effect of improving adhesion, aging release force stability, and high residual adhesion rate

Active Publication Date: 2020-08-18
太仓斯迪克新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, the isolation films used in the protective film products produced by traditional coating manufacturers are ordinary silicone release films, which will cause silicon to transfer to the surface of the protective film adhesive, thereby bringing the risk of silicon contamination of the material. Electronic protective film products have to go through a die-cutting process before they can be finally delivered to end customers. Traditional silicone release films are currently used in the die-cutting process, which will also bring silicon pollution risks to products; the risk of silicon pollution is strictly enforced by end customers. Therefore, coating manufacturers and die-cutting manufacturers are in urgent need of fluorine-free and silicon-free release films that meet the performance requirements. This requires release film companies to speed up the development of high-end special ultra-light, super-heavy non-silicon release films. Products meet market demand

Method used

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  • Ultralight/overweight non-silicon release film and preparation method thereof
  • Ultralight/overweight non-silicon release film and preparation method thereof
  • Ultralight/overweight non-silicon release film and preparation method thereof

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preparation example Construction

[0040] The present invention also provides a preparation method of the above-mentioned ultra-light / ultra-heavy non-silicon release film, comprising the following steps:

[0041] Coat the antistatic primer on the substrate, and form an antistatic primer after baking;

[0042] 500-1000 parts of ester solvent, 50-500 parts of ketone solvent, 50-300 parts of amino-modified acrylic resin, 0-300 parts of hydroxyl-containing acrylic resin, and 5-50 parts of curing agent are configured into a coating liquid;

[0043] Coating the coating liquid on the antistatic primer layer, and forming a non-silicon release coating after baking;

[0044] After aging the semi-finished product obtained above, the finished non-silicon release film is obtained.

[0045] In the present invention, the antistatic primer layer is coated by dimple coating, extrusion coating or screen roll coating, and the wet coating amount is 6-10g / m 2 , The baking temperature after coating is 80-120°C, and the baking time...

Embodiment 1

[0050] This embodiment provides a non-silicon release film resistant to high temperature and high humidity, including a substrate layer, an antistatic primer layer and a non-silicon release coating.

[0051] The formulation of the antistatic base coat is:

[0052] 5% polythiophene aqueous solution 100 parts

[0053] 10 parts of melamine curing agent

[0054] The above components are configured as an antistatic primer, and coated on a 50um PET substrate by using a dimple coating method, and the coating moisture is 6g / m 2 , baked in an oven after coating, the baking temperature is 105°C, and the baking time is 20 seconds to obtain an antistatic primer layer.

[0055] The formulation of the non-silicon release coating is:

[0056]

[0057] The above components are configured into a coating solution, which is coated on the antistatic primer layer by means of dimple coating, and the wet coating amount is 10g / m 2 , baked in an oven after coating, the baking temperature is 120...

Embodiment 2

[0059] This embodiment provides a non-silicon release film resistant to high temperature and high humidity, including a substrate layer, an antistatic primer layer and a non-silicon release coating.

[0060] The formulation of the antistatic base coat is:

[0061] 5% polythiophene aqueous solution 100 parts

[0062] 10 parts of melamine curing agent

[0063] The above components are configured as an antistatic primer, and coated on a 50um PET substrate by using a dimple coating method, and the coating moisture is 6g / m 2 , baked in an oven after coating, the baking temperature is 105°C, and the baking time is 20 seconds to obtain an antistatic primer layer.

[0064] The formulation of the non-silicon release coating is:

[0065]

[0066] The above components are configured into a coating solution, which is coated on the antistatic primer layer by means of dimple coating, and the wet coating amount is 10g / m 2 , baked in an oven after coating, the baking temperature is 120...

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Abstract

The invention discloses an ultralight/overweight non-silicon release film, which comprises a base material layer, an anti-static bottom coating and a non-silicon release coating, wherein the base material layer is coated with the anti-static bottom coating, and the anti-static bottom coating is coated with the non-silicon release coating; the non-silicon release coating is prepared from the following components in parts by weight: 500-1000 parts of an ester solvent, 50-500 parts of a ketone solvent, 0-300 parts of amino-modified acrylic resin, 0-300 parts of hydroxyl-containing acrylic resin and 5-50 parts of a curing agent, wherein the total amount of the amino-modified acrylic resin and the hydroxyl-containing acrylic resin is 300 parts; the viscosity of the amino-modified acrylic resinis 100-300 CPS, and the molecular weight of the amino-modified acrylic resin is 30,000-60,000; the viscosity of the hydroxyl-containing acrylic resin is 200-500 CPS, and the molecular weight of the hydroxyl-containing acrylic resin is 40000-70000. The invention also discloses a preparation method of the ultralight/overweight non-silicon release film. The ultralight/overweight non-silicon release film disclosed by the invention does not contain a silicon element, does not generate silicon pollution, and the release force can be adjusted in a wide range.

Description

technical field [0001] The invention relates to the technical field of adhesive tapes, in particular to an ultra-light / ultra-heavy non-silicon release film and a preparation method thereof. Background technique [0002] The release film refers to a functional film material with low surface energy obtained by coating some special chemical coatings on various films and drying or UV curing. It is an indispensable component of pressure-sensitive adhesive protective film products. It is also a die-cutting material that must be used in the die-cutting industry. Among the release agents required for the release film, compared with other release agents, silicone oil and silicon-containing release agents have many outstanding advantages, such as good transparency, good isolation effect, and a wide range of peeling forces Can be adjusted, high temperature resistance, solvent resistance, coating thickness and silicon content are adjustable, good durability, can be used repeatedly. Si...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/04C08J7/044C08J7/043C09J7/40C09D165/00C09D5/24C09D5/00C09D133/04C09D5/20C09D7/63C08L67/02
CPCC08J7/042C08J7/043C08J7/044C09J7/401C09D165/00C09D5/24C09D5/002C09D133/04C09D5/20C09D5/18C09D7/63C08J2367/02C08J2465/00C08J2433/04C09J2433/005C09J2465/005C08L2201/04C08L2205/025C08L2201/08C08K5/34922C08L33/04C08K5/29
Inventor 金闯裴建军
Owner 太仓斯迪克新材料科技有限公司
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