A kind of ultra-light/super-heavy non-silicon release film and preparation method thereof

A non-silicon release and release film technology, applied in the direction of film/sheet release liner, film/sheet adhesive, conductive coating, etc., can solve the problem of silicon transfer to the surface of the protective film adhesive, material Pollution, product silicon pollution and other issues, to achieve the effects of stable aging release force, improved adhesion, and high residual adhesion rate

Active Publication Date: 2022-08-05
太仓斯迪克新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, the isolation films used in the protective film products produced by traditional coating manufacturers are ordinary silicone release films, which will cause silicon to transfer to the surface of the protective film adhesive, thereby bringing the risk of silicon contamination of the material. Electronic protective film products have to go through a die-cutting process before they can be finally delivered to end customers. Traditional silicone release films are currently used in the die-cutting process, which will also bring silicon pollution risks to products; the risk of silicon pollution is strictly enforced by end customers. Therefore, coating manufacturers and die-cutting manufacturers are in urgent need of fluorine-free and silicon-free release films that meet the performance requirements. This requires release film companies to speed up the development of high-end special ultra-light, super-heavy non-silicon release films. Products meet market demand

Method used

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  • A kind of ultra-light/super-heavy non-silicon release film and preparation method thereof
  • A kind of ultra-light/super-heavy non-silicon release film and preparation method thereof
  • A kind of ultra-light/super-heavy non-silicon release film and preparation method thereof

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preparation example Construction

[0040] The present invention also provides a preparation method of the above-mentioned ultra-light / super-heavy non-silicon release film, comprising the following steps:

[0041] The antistatic primer is coated on the substrate, and after baking, the antistatic primer is formed;

[0042] 500-1000 parts of ester solvent, 50-500 parts of ketone solvent, 50-300 parts of amino-modified acrylic resin, 0-300 parts of hydroxyl-containing acrylic resin, 5-50 parts of curing agent are prepared into coating liquid;

[0043] coating the coating liquid on the antistatic primer layer, and after baking, a non-silicon release coating is formed;

[0044] After curing the semi-finished product obtained above, a finished non-silicon release film is obtained.

[0045] In the present invention, the antistatic primer layer is coated by gravure coating, extrusion coating or anilox coating, and the wet coating amount is 6-10 g / m 2 , the baking temperature after coating is 80-120 ℃, and the baking t...

Embodiment 1

[0050] This embodiment provides a non-silicon release film resistant to high temperature and high humidity, including a substrate layer, an antistatic primer layer and a non-silicon release coating.

[0051] The formulation of the antistatic primer is:

[0052] 5% polythiophene aqueous solution 100 parts

[0053] 10 parts of melamine curing agent

[0054] The above components are configured into an antistatic primer liquid, which is coated on a 50um PET substrate by gravure coating, and the coating moisture is 6g / m2 2 , and bake in an oven after coating, with a baking temperature of 105° C. and a baking time of 20 seconds to obtain an antistatic primer layer.

[0055] The formula for non-silicon release coatings is:

[0056]

[0057] The above components are configured into a coating liquid, which is coated on the antistatic primer layer by gravure coating, and the coating wet coating amount is 10g / m 2 , baked in an oven after coating, the baking temperature is 120° C.,...

Embodiment 2

[0059] This embodiment provides a non-silicon release film resistant to high temperature and high humidity, including a substrate layer, an antistatic primer layer and a non-silicon release coating.

[0060] The formulation of the antistatic primer is:

[0061] 5% polythiophene aqueous solution 100 parts

[0062] 10 parts of melamine curing agent

[0063] The above components are configured into an antistatic primer liquid, which is coated on a 50um PET substrate by gravure coating, and the coating moisture is 6g / m2 2 , and bake in an oven after coating, with a baking temperature of 105° C. and a baking time of 20 seconds to obtain an antistatic primer layer.

[0064] The formula for non-silicon release coatings is:

[0065]

[0066] The above components are configured into a coating liquid, which is coated on the antistatic primer layer by gravure coating, and the coating wet coating amount is 10g / m 2 , baked in an oven after coating, the baking temperature is 120° C.,...

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Abstract

The invention discloses an ultra-light / super-heavy non-silicon release film, comprising a base material layer, an antistatic primer layer coated on the base material layer, and an antistatic primer layer coated on the antistatic primer layer. Non-silicon release coating; the non-silicon release coating is prepared from the following components in parts by weight: 500-1000 parts of ester solvents, 50-500 parts of ketone solvents, amino-modified 0-300 parts of acrylic resin, 0-300 parts of hydroxyl-containing acrylic resin, 5-50 parts of curing agent, and the total amount of amino-modified acrylic resin and hydroxyl-containing acrylic resin is 300 parts; The viscosity of the acrylic resin is 100-300 CPS, and the molecular weight is 3-60,000; the viscosity of the hydroxyl-containing acrylic resin is 200-500 CPS, and the molecular weight is 4-70,000. The invention also discloses a preparation method of the ultra-light / super-heavy non-silicon release film. The ultra-light / super-heavy non-silicon release film of the present invention contains no silicon element, does not produce silicon pollution, and the release force can be adjusted in a wide range.

Description

technical field [0001] The invention relates to the technical field of adhesive tapes, in particular to an ultralight / overweight non-silicon release film and a preparation method thereof. Background technique [0002] Release film refers to a functional film material with low surface energy obtained by coating some special chemical coatings on various films after drying or UV curing. It is an indispensable component of pressure-sensitive adhesive protective film products. Part of it is also a die-cutting material that must be used in the die-cutting industry. Among the release agents required for release films, compared with other release agents, silicone oil and silicon-containing release agents have many outstanding advantages, such as good transparency, good isolation effect, and peeling force in a wide range. Can be adjusted, high temperature resistance, solvent resistance, coating thickness and silicon content can be adjusted, good durability, can be reused. Silicone ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J7/04C08J7/044C08J7/043C09J7/40C09D165/00C09D5/24C09D5/00C09D133/04C09D5/20C09D7/63C08L67/02
CPCC08J7/042C08J7/043C08J7/044C09J7/401C09D165/00C09D5/24C09D5/002C09D133/04C09D5/20C09D5/18C09D7/63C08J2367/02C08J2465/00C08J2433/04C09J2433/005C09J2465/005C08L2201/04C08L2205/025C08L2201/08C08K5/34922C08L33/04C08K5/29
Inventor 金闯裴建军
Owner 太仓斯迪克新材料科技有限公司
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