A kind of ultra-light/super-heavy non-silicon release film and preparation method thereof
A non-silicon release and release film technology, applied in the direction of film/sheet release liner, film/sheet adhesive, conductive coating, etc., can solve the problem of silicon transfer to the surface of the protective film adhesive, material Pollution, product silicon pollution and other issues, to achieve the effects of stable aging release force, improved adhesion, and high residual adhesion rate
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[0040] The present invention also provides a preparation method of the above-mentioned ultra-light / super-heavy non-silicon release film, comprising the following steps:
[0041] The antistatic primer is coated on the substrate, and after baking, the antistatic primer is formed;
[0042] 500-1000 parts of ester solvent, 50-500 parts of ketone solvent, 50-300 parts of amino-modified acrylic resin, 0-300 parts of hydroxyl-containing acrylic resin, 5-50 parts of curing agent are prepared into coating liquid;
[0043] coating the coating liquid on the antistatic primer layer, and after baking, a non-silicon release coating is formed;
[0044] After curing the semi-finished product obtained above, a finished non-silicon release film is obtained.
[0045] In the present invention, the antistatic primer layer is coated by gravure coating, extrusion coating or anilox coating, and the wet coating amount is 6-10 g / m 2 , the baking temperature after coating is 80-120 ℃, and the baking t...
Embodiment 1
[0050] This embodiment provides a non-silicon release film resistant to high temperature and high humidity, including a substrate layer, an antistatic primer layer and a non-silicon release coating.
[0051] The formulation of the antistatic primer is:
[0052] 5% polythiophene aqueous solution 100 parts
[0053] 10 parts of melamine curing agent
[0054] The above components are configured into an antistatic primer liquid, which is coated on a 50um PET substrate by gravure coating, and the coating moisture is 6g / m2 2 , and bake in an oven after coating, with a baking temperature of 105° C. and a baking time of 20 seconds to obtain an antistatic primer layer.
[0055] The formula for non-silicon release coatings is:
[0056]
[0057] The above components are configured into a coating liquid, which is coated on the antistatic primer layer by gravure coating, and the coating wet coating amount is 10g / m 2 , baked in an oven after coating, the baking temperature is 120° C.,...
Embodiment 2
[0059] This embodiment provides a non-silicon release film resistant to high temperature and high humidity, including a substrate layer, an antistatic primer layer and a non-silicon release coating.
[0060] The formulation of the antistatic primer is:
[0061] 5% polythiophene aqueous solution 100 parts
[0062] 10 parts of melamine curing agent
[0063] The above components are configured into an antistatic primer liquid, which is coated on a 50um PET substrate by gravure coating, and the coating moisture is 6g / m2 2 , and bake in an oven after coating, with a baking temperature of 105° C. and a baking time of 20 seconds to obtain an antistatic primer layer.
[0064] The formula for non-silicon release coatings is:
[0065]
[0066] The above components are configured into a coating liquid, which is coated on the antistatic primer layer by gravure coating, and the coating wet coating amount is 10g / m 2 , baked in an oven after coating, the baking temperature is 120° C.,...
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