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Electroplating manufacturing method of deep micro-hole in PCB (Printed Circuit Board)

A manufacturing method and micro-hole technology, applied in the direction of printed circuit manufacturing, electrical components, printed circuits, etc., can solve the problems of deep micro-hole bottom cracks, no copper, etc., to reduce surface tension, avoid cracks, and optimize the production process. Effect

Active Publication Date: 2020-08-25
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims at the problems of the above-mentioned defects in the existing circuit boards, and provides a method for electroplating deep micro-holes in PCBs. This method effectively solves the problems of cracks at the bottom of deep micro-holes and no copper by optimizing the production process.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The electroplating manufacturing method of deep microholes in a kind of PCB shown in this embodiment includes the following processing steps in sequence:

[0029] (1) Cutting: cut out the core board according to the panel size 520mm×620mm, the thickness of the core board is 1mm (excluding the thickness of the outer copper foil), and the thickness of the outer copper surface of the core board is 1OZ.

[0030] (2), making the inner layer circuit (negative film process): according to the pattern positioning hole, use a vertical coating machine to coat the photosensitive film on the core plate. The grid exposure ruler (21 grid exposure ruler) completes the exposure of the inner layer circuit, and forms the inner layer circuit pattern after development; the inner layer etching, etches the inner layer circuit on the core board after exposure and development, and the inner layer line width is measured as 3mil; The inner layer AOI, and then check the open and short circuits, li...

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PUM

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Abstract

The invention discloses an electroplating manufacturing method of a deep micro-hole in a PCB (Printed Circuit Board). The electroplating manufacturing method comprises the following steps of: drillinga blind hole in a production plate; performing twice horizontal copper immersion treatment on the production plate in sequence, so that blind hole is metallized; then putting the production plate ona vertical continuous copper electroplating production line for hole filling electroplating, and increasing the thickness of a copper layer in the hole; then performing vertical copper sinking treatment on the production plate; and then causing the production plate to pass a linear gantry electroplating production line for whole-plate electroplating. The electroplating manufacturing method effectively solves the problems of cracks and no copper at the bottom of the deep micro-hole by optimizing the production technology process and using the sequential combination of multiple different electroplating methods.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to an electroplating production method for deep microholes in PCBs. Background technique [0002] In today's era of rapid development of communication technology, human beings use 5G technology as the latest transmission channel, relying on cloud computing as a resource interaction platform, and make full use of big data to gradually realize the interconnection of all things. In this context, PCB, as a transmission carrier for carrying signals and power, is developing towards high transmission speed, high density, miniaturization, and high reliability. High Density Interconnect (HDI, High Density Interconnect) has become the mainstream technology of PCB processing, and ordinary HDI boards can no longer meet the requirements of terminal manufacturers, so more and more product designs have added deep micro-holes (that is, high thickness-to-diameter ratio Blin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/08C25D3/38C25D5/10C25D7/04C25D7/00H05K3/18
CPCC25D3/38C25D5/08C25D5/10C25D7/00C25D7/04H05K3/188
Inventor 宋建远孙保玉刘亚飞
Owner SHENZHEN SUNTAK MULTILAYER PCB