Semiconductor module packaging method and semiconductor module
A module packaging and semiconductor technology, applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problems of poor heat dissipation, low output efficiency, poor flow capacity, etc. The thickness is freely controllable, the product cost is reduced, and the volume is small.
Inactive Publication Date: 2020-08-28
SIPLP MICROELECTRONICS CHONGQING CO LTD
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Problems solved by technology
[0005] However, the IPM module in the prior art has poor heat dissipation effect and large volume due to the need for a lead frame, and because the electronic components and the lead frame in the package structure are interconnected through leads, the output efficiency is low and the flow capacity is poor. The problem
Method used
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Embodiment 2
[0122] The content of the semiconductor module packaging method in this embodiment is basically the same as the semiconductor module packaging method in Embodiment 1, the difference is that the step of forming the rewiring structure in the semiconductor module packaging method in this embodiment also includes A second rewiring layer and a second dielectric layer are formed.
[0123] Specifically, such as Figure 5(a)-Figure 5(j) As shown, after step 420, the semiconductor module packaging method of this embodiment further includes:
[0124] Step 430: forming a second redistribution layer on the first dielectric layer and the conductive studs;
[0125] Step 440: Form a second dielectric layer on the first dielectric layer, and expose an end of the second redistribution layer away from the conductive stud to the second dielectric layer away from the first One surface of the dielectric layer is exposed.
[0126] The second redistribution layer 24 includes a third metal layer 2...
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The invention provides a semiconductor module packaging method and a semiconductor module. The semiconductor module packaging method comprises the steps of mounting a chip, a driven piece and a plurality of conductive columns on a first conductive metal layer of a DBC board; mounting the DBC board on a carrier plate; covering the whole carrier plate with an encapsulation layer, and carrying out plastic encapsulation on the chip, the driven piece, the conductive columns and the DBC board to form an encapsulation structural member; and forming a rewiring structure on the first surface of the encapsulation structural member, wherein the back surface of the chip is directly and electrically connected with the rewiring structure, and the driven piece and the front surface of the chip are electrically connected with the rewiring structure through different conductive columns. The semiconductor module is manufactured by the semiconductor module packaging method. The semiconductor module has an excellent heat dissipation effect, has the advantages of being small in size, compact in structure and high in reliability, and is suitable for small and light electronic equipment; and compared with a traditional lead bonding packaging mode, the method has the advantages of being small in impedance and high in through-current capability.
Description
technical field [0001] The present application relates to the technical field of semiconductors, in particular to a semiconductor module packaging method and a semiconductor module. Background technique [0002] The plastic-encapsulated IPM module (IntelligentPowerModule, intelligent power module) is a new type of integrated IGBT (InsulatedGateBipolarTransistor, insulated gate bipolar transistor) chip and its drive circuit, control circuit and overcurrent, undervoltage, short circuit, overheating and other protection circuits. control module. [0003] The plastic-encapsulated IPM module is a complex and advanced power module, which can automatically realize complex protection functions such as overcurrent, undervoltage, short circuit and overheating, so it has intelligent features. At the same time, it has the advantages of low cost, miniaturization, high reliability, and easy use. It is widely used in frequency conversion home appliances, inverter power supplies, industria...
Claims
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IPC IPC(8): H01L21/50H01L21/56H01L21/60H01L25/16H01L23/31H01L23/367
CPCH01L21/50H01L21/56H01L24/80H01L25/16H01L23/3107H01L23/367
Inventor 吴建忠霍炎
Owner SIPLP MICROELECTRONICS CHONGQING CO LTD