Ice particle planarization process structure of semiconductor chip production and preparation system

Abstract

The invention discloses an ice particle planarization process structure of a semiconductor chip production and preparation system. According to the ice particle planarization process structure, ahigh-pressure air input pipeline is arranged in the middle of the ice particle planarization process structure; an ice bead and ice particle input pipeline, a deionized water input pipeline and a selectivechemical input pipeline are sequentially arranged on the two sides of the structure; the deionized water input pipeline communicates with the ice bead and ice particle input pipeline; and deionized water is mixed with ice beads and ice particles in an ice particle and water mist mixing area, and then the mixture is sprayed out through a high-pressure air spraying nozzle. The ice particle planarization process structure is simple in structure, can be connected with an automatic control system to realize automatic control, is an indispensable technical feature point of the structural features of the invention, is a technical innovation of one-time expansibility of the prior art, and has good popularization and use values.

Description

technical field [0001] The invention relates to the field of semiconductor processing and manufacturing, in particular to an ice particle planarization process structure of a semiconductor chip production and preparation system. Background technique [0002] The current status of conductor silicon materials, in today's global semiconductor market of more than 200 billion US dollars, more than 95% of semiconductor devices and more than 99% of integrated circuits (LSI) are made of high-purity and high-quality silicon polished wafers and epitaxial wafers. In the next 30-50 years, it will still be the most basic and important functional material in the LSI industry. Semiconductor silicon material has become the most widely used semiconductor material in the contemporary electronics industry due to its comprehensive advantages such as abundant resources, high-quality characteristics, increasingly perfect technology, and a wide range of uses. It is also one of the most pure materi...

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Problems solved by technology

[0003] The process of processing silicon chips includes crystal growth, cutting, polishing, cleaning and other processes. The repeated process steps in integrated circuit manufacturing are as follows Diffusion → film deposition → photolithography → etching → ion implantation → CMP → metallization → heat treatment → testing And other detailed steps, it is normal for the ion implantation process to the diffusion to be tested and repeated several times in the actual application process. In the preparation process, the required environment is a clean room with extremely high requirements, and the mechanized and automated production equipment for each station The site occupation is extremely complicated and expensive, and the preparation process is relatively complicated and the cost is quite high; for example, TSMC's investment in 16nm and 10nm technology is estimated to be between 11.5 billion and 12 billion US dollars. The primary problem facing innovation in domain technology

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