Scanning type electrodeposition processing method and device adopting parallel arrangement of multiple line anodes

Abstract

The invention discloses a scanning type electrodeposition processing method and device adopting parallel arrangement of multiple line anodes. The device comprises a fixed plate, a stirring paddle, thelinear anodes, a cathode substrate and an electrodeposition power supply. The device is characterized in that the device further comprises a stirring paddle mounting frame and a touch device, whereinthe stirring paddle mounting frame is provided with a cross beam and side beams. The two side beams are correspondingly located at two ends of the cross beam, are perpendicular to the cross beam, andare provided with front guide grooves and rear guide grooves. 3-5 sheet-shaped stirring paddles are equidistantly arranged on the stirring paddle mounting frame in parallel. On the basis of the device, the distances between the anodes and all limit movement positions of all the linear anodes are adjusted first, then the electrodeposition power supply is turned on after an electrolyte is introduced, constant-speed linear reciprocating scanning type electrodeposition processing is performed, and electrodeposition is stopped until a deposited layer reaches the required thickness. According to the scanning type electrodeposition processing method and the device, on the basis of maintaining excellent thickness distribution uniformity, the deposition speed and the production efficiency can be greatly improved, the edge effect is smaller, the phenomenon that the edge is thick is basically eliminated, and implementation is easy.

Description

technical field [0001] The invention belongs to the field of electrochemical processing, in particular to a scanning electrodeposition processing method and device. Background technique [0002] The existing electrodeposition technology generally adopts the rack plating mode, but the thickness uniformity of electrodeposited parts / layers based on this mode is often difficult to meet the requirements of high-end applications. For this reason, the patent application number CN201810453008.1 discloses a device for performing electrodeposition based on reciprocating scanning of the line anode close to the cathode. The thickness uniformity of electrodeposited parts / layers obtained based on this device is significantly better than that of conventional rack plating. However, because the anode of the device is in the shape of a linear filament and is always in reciprocating motion, the thickening of the metal layer is a periodic layer-by-layer micro-superimposition process, rather th...

AI Technical Summary

Problems solved by technology

However, because the anode of the device is in the shape of a linear filament and is always in reciprocating motion, the thickening of the metal layer is a periodic layer-by-layer micro-superimposition process, rather than a continuous uninterrupted growth process, resulting in a deposition rate of Extremely slow and low productivity

Images