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Scanning type electrodeposition processing method and device adopting parallel arrangement of multiple line anodes

A processing device and electrodeposition technology, applied in electrodes, electrolysis processes, electrolysis components, etc., can solve the problems of low production efficiency and slow deposition speed, and achieve the effect of small edge effect, elimination of partial thickness phenomenon, and avoiding the aggravation of edge effect.

Active Publication Date: 2020-09-11
HENAN POLYTECHNIC UNIV
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

However, because the anode of the device is in the shape of a linear filament and is always in reciprocating motion, the thickening of the metal layer is a periodic layer-by-layer micro-superimposition process, rather than a continuous uninterrupted growth process, resulting in a deposition rate of Extremely slow and low productivity

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  • Scanning type electrodeposition processing method and device adopting parallel arrangement of multiple line anodes
  • Scanning type electrodeposition processing method and device adopting parallel arrangement of multiple line anodes
  • Scanning type electrodeposition processing method and device adopting parallel arrangement of multiple line anodes

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Embodiment Construction

[0022] The present invention will be further described below in conjunction with the accompanying drawings.

[0023] refer to figure 1 , figure 2 and image 3 , The device of the present invention includes a fixed plate 2, a stirring paddle 5, a linear anode 6, a cathode base 7 and an electrodeposition power supply 9, and it also includes a paddle mounting frame 4 and a touch device 8. The stirring paddle installation frame 4 is provided with crossbeam 4-1 and side beam 4-2, and sidebeam 4-2 is two, is respectively positioned at the two ends of crossbeam 4-1 and is all vertical with crossbeam 4-1, and sidebeam 4-2 A front guide groove 4-2b and a rear guide groove 4-2c are provided. The paddle 5 is sheet-shaped, with a through hole 5-3 in the middle, and a mounting shaft 5-2 on the left and right sides of the upper part, and the mounting shaft 5-2 is slidably connected to the front guide groove 4-2b or 4-2c , and then install the touch device 8 at the end of the installati...

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Abstract

The invention discloses a scanning type electrodeposition processing method and device adopting parallel arrangement of multiple line anodes. The device comprises a fixed plate, a stirring paddle, thelinear anodes, a cathode substrate and an electrodeposition power supply. The device is characterized in that the device further comprises a stirring paddle mounting frame and a touch device, whereinthe stirring paddle mounting frame is provided with a cross beam and side beams. The two side beams are correspondingly located at two ends of the cross beam, are perpendicular to the cross beam, andare provided with front guide grooves and rear guide grooves. 3-5 sheet-shaped stirring paddles are equidistantly arranged on the stirring paddle mounting frame in parallel. On the basis of the device, the distances between the anodes and all limit movement positions of all the linear anodes are adjusted first, then the electrodeposition power supply is turned on after an electrolyte is introduced, constant-speed linear reciprocating scanning type electrodeposition processing is performed, and electrodeposition is stopped until a deposited layer reaches the required thickness. According to the scanning type electrodeposition processing method and the device, on the basis of maintaining excellent thickness distribution uniformity, the deposition speed and the production efficiency can be greatly improved, the edge effect is smaller, the phenomenon that the edge is thick is basically eliminated, and implementation is easy.

Description

technical field [0001] The invention belongs to the field of electrochemical processing, in particular to a scanning electrodeposition processing method and device. Background technique [0002] The existing electrodeposition technology generally adopts the rack plating mode, but the thickness uniformity of electrodeposited parts / layers based on this mode is often difficult to meet the requirements of high-end applications. For this reason, the patent application number CN201810453008.1 discloses a device for performing electrodeposition based on reciprocating scanning of the line anode close to the cathode. The thickness uniformity of electrodeposited parts / layers obtained based on this device is significantly better than that of conventional rack plating. However, because the anode of the device is in the shape of a linear filament and is always in reciprocating motion, the thickening of the metal layer is a periodic layer-by-layer micro-superimposition process, rather th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D21/12C25D21/10C25D17/12C25D17/00C25D5/04
CPCC25D21/12C25D21/10C25D17/12C25D17/00C25D5/04Y02P10/25
Inventor 明平美侯亚楠张峻中闫亮郑兴帅张新民秦歌李欣潮王伟牛屾
Owner HENAN POLYTECHNIC UNIV
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