Device for preparing high-shielding substrate coating

Abstract

The invention discloses a device for preparing a high-shielding substrate coating, and relates to the technical field of coating devices. The device for preparing the high-shielding substrate coatingmainly comprises a vacuum chamber, a first flange hole is formed in the rear side of the middle of the vacuum chamber in the horizontal direction, and a to-be-machined workpiece enters the vacuum chamber through the first flange hole; the vacuum chamber also communicates with a gas ion source system, a deposition system and a molecular pump; the vacuum chamber is provided with an air inlet; surface gas ion source cleaning is performed on the to-be-machined workpiece through the gas ion source system; nitrogen is introduced to carry out surface nitridation, the fatigue resistance of a substrateis improved, and preparation of a circulating multilayer coating is performed; and the workpiece is rotated in the vacuum chamber. Each layer in the unit coating is a mixture of nitride and oxide nanocrystals, so that the internal stress generated during deposition can be released, and oxides of Al and Cr in the coating have good high-temperature resistance at the same time.

Description

technical field [0001] The invention relates to the technical field of coating devices, in particular to a device for preparing a high-shielding substrate coating. Background technique [0002] The traditional coating technology is magnetron sputtering, multi-arc, electron beam deposition, etc. The combination of these technology deposition cannot meet the preparation requirements of high bonding strength and ultra-thick and ultra-dense film layer, especially the coating of workpiece samples with high occlusion; this patented device Adding a magnetic filtration deposition device, the magnetic filtration deposition technology has unique deposition advantages in this respect: 1. The density of the film prepared by it is close to that of the bulk material; 2. All the ions are extracted, and the ionization rate is 100%. It is very conducive to the improvement of the bonding strength with the substrate; 3. Its preparation can conveniently set the air flow rate, and can convenient...

AI Technical Summary

Problems solved by technology

[0004] Traditional technologies such as multi-arc technology, although the deposition speed is fast, have a major defect, that is, there are a large number of micron-sized particles when depositing the film layer, and the micron-sized particles have a great impact on the quality of the film layer, especially at high speeds. Where there are micron particles in dust or salt spray environment, it is easy to form preferential corrosion or preferential sputtering, which greatly reduces the effect of the film layer.

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