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Sheet for sintering bonding and sheet for sintering bonding with base material

A technology that uses sheets and sinterability, and is applied in the direction of welding/cutting media/materials, welding media, welding equipment, etc., which can solve problems such as inefficiency and achieve good operating efficiency.

Pending Publication Date: 2020-09-22
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this approach is not efficient

Method used

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  • Sheet for sintering bonding and sheet for sintering bonding with base material
  • Sheet for sintering bonding and sheet for sintering bonding with base material
  • Sheet for sintering bonding and sheet for sintering bonding with base material

Examples

Experimental program
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Effect test

Embodiment 1

[0109] will be used as sintered particles P 1 56.25 parts by mass of silver particles, polycarbonate resin (trade name "QPAC40", weight-average molecular weight of 150,000, solid at room temperature, manufactured by EmpowerMaterials) as a polymer binder (thermally decomposable polymer binder) 2.16 parts by mass, 2.16 parts by mass of isobornylcyclohexanol (trade name "Terusolve MTPH", liquid at normal temperature, manufactured by Nippon Terpene Chemicals, Inc.) as a low molecular weight binder (low boiling point binder), With 39.43 parts by mass of methyl ethyl ketone as a solvent, it was mixed in its stirring mode using a mixing mixer (trade name "HM-500", manufactured by KEYENCE CORPORATION) to prepare a varnish. The stirring time was set to 3 minutes. as sintered particles P 1 The aforementioned silver particles include first silver particles (average particle diameter 60 nm, manufactured by DOWA ELECTRONICS MATERIALSCO., LTD.) and second silver particles (average particl...

Embodiment 2

[0111] Sintered particles P 1 56.98 parts by mass instead of 56.25 parts by mass, 0.75 parts by mass of polycarbonate resin (trade name "QPAC40", manufactured by Empower Materials) instead of 2.16 parts by mass, isoborneol The compounding quantity of methyl cyclohexanol (trade name "Terusolve MTPH", manufactured by Nippon Terpene Chemicals, Inc.) was 2.98 parts by mass instead of 2.16 parts by mass, and the amount of methyl ethyl ketone was 39.29 parts by mass. The sheet for sinter bonding of Example 2 was produced in the same manner as the sheet for sinter bonding of Example 1 instead of 39.4 parts by mass. The sheet for sinter bonding of Example 2 had a sinterable particle content ratio of 93.9% by mass and a thickness of 53 μm.

Embodiment 3

[0113] Sintered particles P 1 instead of 56.25 parts by mass, the compounded amount of polycarbonate resin (trade name "QPAC40", manufactured by Empower Materials Co., Ltd.) was set to 0.9 parts by mass instead of 2.16 parts by mass, and isoborneol The compounding quantity of methyl cyclohexanol (trade name "Terusolve MTPH", manufactured by Nippon Terpene Chemicals, Inc.) was 3.6 parts by mass instead of 2.16 parts by mass, and the amount of methyl ethyl ketone was 39.47 parts by mass. The sheet for sinter bonding of Example 3 was produced in the same manner as the sheet for sinter bonding of Example 1 instead of 39.43 parts by mass. The sheet for sinter bonding of Example 3 had a sinterable particle content ratio of 92.6% by mass and a thickness of 54 μm.

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Abstract

The present invention provides a sheet for sintering bonding and the same with a base material suited for lamination and integration and also suited for realizing satisfactory operational efficiency in a sintering process in a process of producing semiconductor devices that go through sintering bonding of semiconductor chips. The sheet for sintering bonding (10) of the present invention comprisesan electrically conductive metal containing sinterable particle and a binder component. In this sheet, the minimum load, reached during an unloading process in load-displacement measurement accordingto a nanoindentation method, is -100 to -30 [mu]N. Alternatively, the ratio of the minimum load to a maximum load, reached during a load applying process in the above measurement, is -0.2 to -0.06. Asheet body (X), a sheet for sintering bonding with a base material of the present invention, has a laminated structure comprising a base material (B) and the sheet (10).

Description

technical field [0001] The present invention relates to a sheet for sinter bonding and a sheet for sinter bonding with a base material which can be used in the manufacture of semiconductor devices and the like. Background technique [0002] In the manufacture of semiconductor devices, as a method of electrically connecting a semiconductor chip to a support substrate such as a lead frame or an insulated circuit substrate and simultaneously performing chip bonding, it is known to form an Au-Si joint between the support substrate and the chip. The method of realizing the bonding state by using a crystal alloy layer; the method of using solder or resin containing conductive particles as the bonding material. [0003] On the other hand, the spread of power semiconductor devices responsible for power supply control has become remarkable in recent years. A power semiconductor device often generates a large amount of heat due to a large amount of energization during operation. The...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/30C09J9/02C09J169/00C09J11/06H01L23/00H01L23/488
CPCC09J7/30C09J9/02C09J169/00C09J11/06H01L23/488H01L24/29H01L24/83C08K2003/0806C09J2469/00H01L2224/29099H01L2224/8384C08K3/08C08K5/05H01L2224/27436H01L2224/27002H01L2224/27003H01L2224/05639H01L2224/04026H01L2224/83907H01L2224/29339H01L2224/29347H01L2224/29387H01L2224/29344H01L2224/29364H01L2224/29311H01L2224/29355H01L2224/29444H01L2224/29439H01L2224/83439H01L2224/83055H01L2224/83065H01L2224/2939H01L2224/05166H01L2224/05073H01L2224/0345H01L2224/95H01L24/03H01L24/27H01L24/95H01L2224/32245H01L2224/32227H01L2224/83444H01L2224/83455H01L2224/83464H01L2224/83469H01L2224/83203H01L2224/83075H01L24/85H01L2224/85205H01L2224/85207H01L2224/45144H01L2224/45124H01L2224/45147H01L24/92H01L2224/97H01L24/97H01L2224/92247H01L2224/73265H01L2224/271H01L24/05H01L24/32H01L24/73H01L2924/181H01L2924/10272H01L2924/1033B23K35/0244H01L2924/00014H01L2924/0541H01L2924/01047H01L2924/01029H01L2924/054H01L2924/01046H01L2924/0544H01L2924/0105H01L2224/27H01L2924/00012H01L2224/83H01L2224/85B23K26/702B23K35/24H01L21/4814B32B2260/025B32B2260/046B32B2307/536B32B5/16B32B2264/105
Inventor 三田亮太市川智昭
Owner NITTO DENKO CORP