A general-purpose structured silicon connection layer with built-in test circuits
A technology with a built-in test circuit and a general structure, applied in the direction of measuring electricity, measuring electrical variables, and measuring devices, can solve problems such as difficulty in ensuring production yield, FPGA influence, and abnormal function of the silicon connection layer, and achieve rapid screening and assurance The effect of production yield
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[0025] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings.
[0026] The present application provides a general-purpose silicon connection layer with a built-in test circuit, the silicon connection layer is mainly used for signal interconnection between dies in a multi-die device, and the surface of the silicon connection layer 1 is preset There are several silicon connection layer input connection points 11 and several silicon connection layer output connection points 12, these connection points are used for corresponding connection with the connection points on the surface of the die, the silicon connection layer input connection point 11 and the silicon connection layer output connection point 12 are arranged according to a predetermined structure.
[0027] In order to improve the structural versatility of the silicon connection layer, the silicon connection layer input connection point 11 and the sil...
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