Ultraviolet curing adhesive as well as preparation method and application thereof

An ultraviolet light, curing glue technology, applied in the direction of adhesives, adhesive additives, adhesive types, etc., can solve the problems of high cost, narrow application area, difficult surface roughness, etc., to achieve fast curing speed and good reliability. , Dispensing convenient effect

Active Publication Date: 2020-10-09
上海仁速新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it cannot be peeled off automatically by heating, and can only be peeled off during anodizing treatment. The application area is narrow, the cost is high, and the roughness of the surface makes it difficult to completely fit the protected product.

Method used

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  • Ultraviolet curing adhesive as well as preparation method and application thereof
  • Ultraviolet curing adhesive as well as preparation method and application thereof
  • Ultraviolet curing adhesive as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] This embodiment provides a UV-curable adhesive, and the UV-curable adhesive includes the following components in parts by weight:

[0056]

[0057]

[0058] The preparation method of the ultraviolet light curing adhesive described in this embodiment comprises the following steps:

[0059] (1) Mix and stir the urethane acrylate oligomer, acrylic resin and acrylic monomer at 25° C. at a speed of 100 rpm for 15 minutes to obtain the first mixture;

[0060] (2) Mix and stir the first mixture, photoinitiator and antioxidant obtained in step (1) at a speed of 110 rpm for 30 min at 25° C. to obtain a second mixture;

[0061] (3) The second mixture obtained in step (2), thermal debonding filler, surfactant, leveling agent and dispersant were mixed and stirred at 130 rpm for 30 minutes at 25°C, and then filtered at 200 meshes to obtain the UV curable adhesive.

Embodiment 2

[0063] This embodiment provides a UV-curable adhesive, and the UV-curable adhesive includes the following components in parts by weight:

[0064]

[0065] The preparation method of the ultraviolet light curing adhesive described in this embodiment comprises the following steps:

[0066] (1) Mix and stir the urethane acrylate oligomer, acrylic resin and acrylic monomer at 20° C. at a speed of 100 rpm for 15 minutes to obtain the first mixture;

[0067] (2) Mix and stir the first mixture, photoinitiator and antioxidant obtained in step (1) at a speed of 110 rpm for 30 min at 20° C. to obtain a second mixture;

[0068] (3) The second mixture obtained in step (2), thermal debonding filler, surfactant, leveling agent and dispersant were mixed and stirred at 130 rpm for 30 minutes at 20°C, and then filtered at 300 meshes to obtain the UV curable adhesive.

Embodiment 3

[0070] This embodiment provides a UV-curable adhesive, and the UV-curable adhesive includes the following components in parts by weight:

[0071]

[0072] The preparation method of the UV-curable adhesive described in this example is the same as that in Example 1.

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Abstract

The invention provides an ultraviolet curing adhesive as well as a preparation method and application thereof. The ultraviolet curing adhesive is prepared from the following components, by weight: 10to 60 parts of urethane acrylate oligomer, 10 to 50 parts of thermal debonding filler, 10 to 40 parts of acrylic resin, 20 to 40 parts of an acrylate monomer, 1 to 5 parts of a photoinitiator and 3 to10 parts of a surfactant. The ultraviolet curing adhesive has the advantages of being good in bonding strength, high in curing speed, capable of being automatically stripped and disengaged after being heated, high in disengagement speed, free of disengagement residues, good in reliability and the like.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to an ultraviolet light curing adhesive and its preparation method and application. Background technique [0002] With the development of society, many industries need temporary bonding and protection of materials under the limitation of technology. In the case that a certain process may position or damage the material, use UV glue to bond or protect it, remove it after the process is completed, and then proceed to the next process. Due to the different processes, there are also various requirements for temporary bonding and protective colloids, such as resistance to certain high temperatures, corrosion resistance to various chemicals, and physical cutting resistance such as CNC. The traditional temporary bonding mainly uses paraffin and hydrolytic glue, which has low bonding strength. After the paraffin is peeled off, the cleaning process is troublesome and easily ca...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/14C09J133/04C09J11/00C09J11/08C09J11/06C08J9/32C08L75/14C08L33/04
CPCC09J175/14C09J133/04C09J11/00C09J11/08C09J11/06C08J9/32C08J2203/22C08J2375/14C08J2333/04C08J2433/04C08L2205/035C08L33/04C08L71/02C08K5/526C08K5/1345C08L75/14
Inventor 江中洋刘翘楚
Owner 上海仁速新材料有限公司
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