Polyamide resin composition, molded body thereof, and method for manufacturing laser-welded body

A technology of polyamide resin and laser welding, which is applied in the direction of chemical instruments and methods, synthetic resin layered products, layered products, etc., can solve the problems of insufficient laser transmittance and difficulty in obtaining laser welding, and achieve high durability Effects of heat resistance, high mechanical strength, and good welding strength

Active Publication Date: 2020-10-13
MITSUI CHEM INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0011] In addition, the resin composition described in Patent Document 2 also has the problem of insufficient laser transmittance and difficulty in obtaining sufficient laser weldability.

Method used

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  • Polyamide resin composition, molded body thereof, and method for manufacturing laser-welded body
  • Polyamide resin composition, molded body thereof, and method for manufacturing laser-welded body
  • Polyamide resin composition, molded body thereof, and method for manufacturing laser-welded body

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Embodiment

[0178] Hereinafter, the present invention will be described with reference to examples. The scope of the present invention is not limitedly interpreted by the Examples.

[0179] 1. Preparation of materials

[0180] (1) Polyamide resin (A)

[0181]

[0182] 2800g (24.1 moles) of 1,6-hexanediamine, 2774g (16.7 moles) of terephthalic acid, 1196g (7.2 moles) of isophthalic acid, 36.6g (0.30 moles) of benzoic acid, and 5.7 grams of sodium hypophosphite monohydrate g and 545 g of distilled water were placed in an autoclave with an inner capacity of 13.6 L, and nitrogen substitution was performed. Stirring was started from 190°C, and the internal temperature was raised to 250°C over 3 hours. At this time, the internal pressure of the autoclave was increased to 3.03 MPa. The reaction was continued for 1 hour in this state, and after that, the air was released from the spray nozzle installed in the lower part of the autoclave to extract the low-order condensate. Then, the low-gr...

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Abstract

This polyamide resin composition contains: 30-89.9 parts by mass of a polyamide resin (A) having a melting point of at least 300 DEG C; 0-45 parts by mass of a polyamide resin (B) having substantiallyno melting point; 0.1-5 parts by mass of a light-transmitting pigment (C); and 10-55 parts by mass of a fibrous filler (D) (the total amount of (A), (B), (C), and (D) is 100 parts by mass). The polyamide resin (A) contains at least a terephthalic acid-derived component unit. In a molded body of the polyamide resin composition, the corrected heat of fusion ([delta]HR) is 10-70 J/g, and the transmittance of laser light having a wavelength of 940 nm is at least 15% at a thickness of 1.6 mm.

Description

technical field [0001] The present invention relates to a method for producing a polyamide resin composition, its molded body, and a laser welded body. Background technique [0002] As one of methods for joining thermoplastic resin members to each other, a laser welding method is known. As the characteristics of the laser welding method, the following features can be cited: welding can be performed without making the laser generating part contact the position to be welded; due to local heating, the thermal influence on the peripheral part is very small; there is no Risk of mechanical vibration; components with fine parts, three-dimensional and complex structures can be welded to each other; high reproducibility; high airtightness can be maintained; high welding strength; it is difficult to identify the boundary of the welded part visually; Does not generate dust; etc. [0003] As a laser welding method, there is disclosed a method in which a first resin member that is weak...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/06B29C65/16C08K3/01C08K7/02
CPCC08L77/06C08G69/265C08G69/26C08K7/14C08K3/346C08K3/013B29C65/1635B29C66/1122B29C66/43B29C66/71B29C66/73115B29C65/1677B29C66/73921B29C65/1616B29C66/73117B29C66/73121B29K2077/00C08K7/02B29C65/16C08L2205/025B32B27/08B32B27/34B32B2250/02B32B2250/24
Inventor 西野浩平宝谷洋平鹫尾功
Owner MITSUI CHEM INC
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