Circuit board and manufacturing method thereof
A manufacturing method and circuit board technology, applied in the directions of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve the problems of complex manufacturing process and high manufacturing cost
Inactive Publication Date: 2020-10-20
SHENNAN CIRCUITS
View PDF5 Cites 3 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0002] With the rapid increase of global network data, the network infrastructure must have large capacity, high bandwidth, zero delay, high reliability and high-speed, flexible access, making its capacity requirements are also increasing, circuit board metallization The non-continuous conduction structure of the hole can achieve this effect. The conduction structure of the inner layer of the traditional process is to laminate the prepreg and copper foil on the inner circuit board for multiple times, and then drill according to the traditional process. Hole electroplating to make interlayer conduction structure (that is, traditional through hole, blind hole, buried hole), and make inner layer circuit of copper foil according to the traditional process. The traditional process needs to be laminated multiple times, and the production process is relatively complicated. high production cost
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0028] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.
[0029] See figure 1 , is a structural schematic diagram of the first embodiment of the circuit board of the present invention. The circuit board 10 includes two first circuit boards 100, and a first copper-resistant material layer 103 at the position where drilling holes are required on the opposite surfaces of the two first circuit boards 100. The two first circuit boards 100 are arranged opposite to each other, so that The first copper-resistant material layers 103 on the two first circuit boards 100 are opposite to each other, and the first adhesive sheet 104 located between the two first circuit boards 100 is used to bond the two first circuit boards 100 and is located on the two first circuit boards 100 The position area of the first anti-copper material 103 and the through hole 105 that runs through the two first circuit boards 100 and the fi...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides a circuit board and a manufacturing method thereof. The circuit board comprises two first circuit boards which are oppositely arranged; first copper-resistant material layers located at the positions, needing to be drilled, of the two opposite surfaces of the two first circuit boards; A first bonding sheet positioned between the first copper-resistant material layers of thetwo first circuit boards and used for bonding the two first circuit boards; a through hole positioned in the position area of the first copper-resistant material layer, penetrating through the two first circuit boards and the first bonding sheet and exposing the first copper-resistant material layer; a conductive material, positioned on the side wall of the through hole; and electroplated layers positioned on the conductive material and on the surfaces of the sides, far away from the first copper-resistant material layer, of the two first circuit boards. Therefore, a non-continuous metallizedblind hole structure is realized, the wiring density is increased, any layer of fault is realized, and meanwhile, the signal hole back drilling zero stub can be realized, so that the signal integrityis improved.
Description
technical field [0001] The invention relates to the field of circuit boards, in particular to a circuit board with a discontinuous metallized hole structure and a manufacturing method thereof. Background technique [0002] With the rapid increase of global network data, the network infrastructure must have large capacity, high bandwidth, zero delay, high reliability and high-speed, flexible access, making its capacity requirements are also increasing, circuit board metallization The non-continuous conduction structure of the hole can achieve this effect. The conduction structure of the inner layer circuit in the traditional process is to laminate the prepreg and copper foil on the inner layer circuit board for multiple times, and then drill according to the traditional process. Hole electroplating to make interlayer conduction structure (that is, traditional through hole, blind hole, buried hole), and make inner layer circuit of copper foil according to traditional technolog...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): H05K1/11H05K3/42
CPCH05K1/115H05K3/42H05K3/429H05K2201/09563H05K2201/096
Inventor 杨中瑞韩雪川丁大舟
Owner SHENNAN CIRCUITS