Regenerated sub-solution reuse method

A technology of regenerated son and regenerated liquid, which is applied in the field of regenerated son liquid reuse, and can solve the problems affecting the etching effect of etching line on copper foil

Active Publication Date: 2020-10-23
深圳市祺鑫环保科技有限公司
View PDF12 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, the regenerated sub-liquid can be reused to the etching line after being mixed with the hydrochloric acid solution. However, in the process of mixing the hydrochloric acid and the regenerated sub-liquid, affected by t

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Regenerated sub-solution reuse method
  • Regenerated sub-solution reuse method
  • Regenerated sub-solution reuse method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] Detect the specific gravity and acidity of the working liquid in the etching tank. When the specific gravity of the working liquid reaches 1.2, add the regeneration sub-liquid into the working liquid in the etching tank. Among them, the regeneration sub-solution includes 20g / L of copper ions, 3mol / L of hydrogen ions, 220mol / L of chloride ions and 40g / L of ammonium ions, and the oxidation-reduction potential of the regeneration sub-liquid is 530mV; when the acidity of the working fluid After the temperature is reduced to 0.5 mol / L, a 31% hydrochloric acid solution is added to the working solution in the etching tank. The parameters of the working fluid in the etching tank are controlled as follows: hydrogen ion 0.5mol / L, specific gravity 1.2. Under this condition, after the circuit board was continuously etched for 4 hours with the cosmic level spray etching line, the parameters of the working fluid and the etching rate were tested.

Embodiment 2

[0051] Detect the specific gravity and acidity of the working liquid in the etching tank. When the specific gravity of the working liquid reaches 1.2, add the regeneration sub-liquid into the working liquid in the etching tank. Among them, the regeneration sub-solution includes 20g / L of copper ions, 3mol / L of hydrogen ions, 220mol / L of chloride ions and 40g / L of ammonium ions, and the oxidation-reduction potential of the regeneration sub-liquid is 530mV; when the acidity of the working fluid After reaching 1.0 mol / L, add a hydrochloric acid solution with a mass fraction of 31% into the working solution in the etching tank. The parameters of the working fluid in the etching tank are controlled as follows: hydrogen ion 1.0mol / L, specific gravity 1.2. Under this condition, after the circuit board was continuously etched for 4 hours with the cosmic level spray etching line, the parameters of the working fluid and the etching rate were detected.

Embodiment 3

[0053] Detect the specific gravity and acidity of the working liquid in the etching tank. When the specific gravity of the working liquid reaches 1.2, add the regeneration sub-liquid into the working liquid in the etching tank. Among them, the regeneration sub-liquid includes 20g / L of copper ions, 3mol / L of hydrogen ions, 220mol / L of chloride ions and 40g / L of ammonium ions, and the oxidation-reduction potential of the regeneration liquid is 530mV; when the acidity of the working liquid is low After reaching 1.5 mol / L, add a hydrochloric acid solution with a mass fraction of 31% into the working solution in the etching tank. The parameters of the working fluid in the etching tank are controlled as follows: hydrogen ion 1.5mol / L, specific gravity 1.2. Under this condition, after the circuit board was continuously etched for 4 hours with the cosmic level spray etching line, the parameters of the working fluid and the etching rate were detected.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a regenerated sub-solution reuse method comprising the following steps: obtaining a regenerated sub-solution and a hydrochloric acid solution; detecting the specific gravity ofa working solution above an etching line, and adding the regenerated sub-solution to the working solution according to the specific gravity of the working solution; and detecting the acidity of the working solution, and adding the hydrochloric acid solution to the working solution according to the acidity of the working solution. That is, the technical scheme of the invention avoids precipitationof ammonium chloride in the regenerated sub-solution and ensures the etching effect of the added regenerated sub-solution.

Description

technical field [0001] The invention relates to the technical field of regenerating sub-liquid reuse, in particular to a method for reusing regenerated sub-liquid. Background technique [0002] The acidic etching waste solution will form a low-copper electrolyte in the process of electrolytic recovery of copper. The low-copper electrolyte is also called a regeneration solution. Since the regeneration solution contains the components of the acid etching solution, in order to make full use of the regeneration solution and reduce the waste of raw materials, Usually, the regeneration liquid is used back to the etching line, so as to realize the recycling of the regeneration liquid. At present, the recycling method of the regeneration liquid is to add ammonium chloride, etc. to the regeneration liquid, so as to configure the regeneration liquid. In this way, the regenerated sub-liquid can be reused to the etching line after being mixed with the hydrochloric acid solution. Howeve...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C23F1/46C23F1/18
CPCC23F1/46C23F1/18
Inventor 李再强张伟奇黄文涛曹玉萍梁民
Owner 深圳市祺鑫环保科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap