A kind of u-w-n ternary film and its preparation method and application
A U-W-N, thin-film technology, applied in nuclear reactors, fusion reactors, thermonuclear fusion reactors, etc., can solve problems such as limited ability to suppress stimulated Brillouin scattering, complex uranium black cavity structure layer, and easy excitation of epithermal electrons, etc. Effects of suppressing M-band hard X-ray and epithermal electron yield, protecting uranium black cavity conversion layer, good interfacial adhesion and chemical compatibility
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specific Embodiment approach 1
[0008] Embodiment 1: This embodiment is a U-W-N ternary film, which is characterized in that the mass fraction of N in the U-W-N ternary film is x%, and 0<x≤66.7, and the mass fraction of W is y%, and 0< y≤10%, the remainder is U, and the thickness of the U-W-N ternary film is 100nm-700nm.
specific Embodiment approach 2
[0009] Embodiment 2: This embodiment is a preparation method of a U-W-N ternary thin film, which is specifically completed according to the following steps: using a DC reactive magnetron sputtering co-deposition method, using Ar as a protective gas, and using N 2 As the reaction gas, the U-target and the W target are used for magnetron sputtering deposition through a DC power supply to obtain a U-W-N ternary thin film. The purity of the U target is >99%, the purity of the W target is >99.99%, and the Ar Purity>99.9999%, the N 2 The purity of >99.9999%.
specific Embodiment approach 3
[0010] Embodiment 3: The difference between this embodiment and Embodiment 2 is that the specific process of the DC reactive magnetron sputtering co-deposition method is as follows:
[0011] 1. Install 1 to 9 mandrels on the rotating support table, adjust the distance between the U target and the center of the mandrel to be 10cm to 20cm, and the normal line of the U target center and the plane of the mandrel form an angle of 45°; adjust the W target and the mandrel. The distance between the center of the mandrel is 10cm to 20cm, and the normal line of the center of the W target surface and the plane where the mandrel is located forms an included angle of 45°; the normal lines of the U target and the W target and the plane where the mandrel is located are symmetrically distributed;
[0012] 2. The vacuum degree of the deposition chamber can reach 1×10 by vacuuming by mechanical pump and molecular pump -8 Pa~1×10 -6 Pa, then filled with protective gas and reaction gas, the gas ...
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